Hardware Manual
Table Of Contents
- WE865-DUAL Hardware User Guide
- Contents
- 1 Overview
- 2 Mechanical description
- 3 Pin-out
- 4 Electrical description
- 5 Thermal design guidelines
- 6 PCB layout design guidelines
- 7 Antenna
- 8 Integration with the GE863-PRO3
- 9 WE865-DUAL - Evaluation kit
- 10 Mounting the WE865-DUAL on the application board
- 11 Moisture sensitivity
- 12 Conformity assessment issues
- 13 Safety recommendations
- 14 Document change log
WE865-DUAL HW User Guide
1vv0300787 Rev. 1 - 03/10/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 41 of 48
Figure 20
Recommendations for PCB pad dimensions
Dimension Value [mm]
Ball pitch 2
Solder resist opening diameter A 1,150
Metal PAD diameter B 1 +/- 0,05
Table 15
Placement of microvias not covered by solder resist is not recommended inside the “Solder resist
Opening”,unless the microvia carry the same signal of the pad itself.