Hardware Manual
Table Of Contents
- WE865-DUAL Hardware User Guide
- Contents
- 1 Overview
- 2 Mechanical description
- 3 Pin-out
- 4 Electrical description
- 5 Thermal design guidelines
- 6 PCB layout design guidelines
- 7 Antenna
- 8 Integration with the GE863-PRO3
- 9 WE865-DUAL - Evaluation kit
- 10 Mounting the WE865-DUAL on the application board
- 11 Moisture sensitivity
- 12 Conformity assessment issues
- 13 Safety recommendations
- 14 Document change log
WE865-DUAL HW User Guide
1vv0300787 Rev. 1 - 03/10/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 40 of 48
10 Mounting the WE865-DUAL on the
application board
The Telit WE865-DUAL module has been designed in order to be compliant with a standard lead-free
SMT process.
10.1 Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120μm.
10.2 PCB pad design
"Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.
Figure 19