WE865-DUAL Hardware User Guide 1vv0300787 Rev.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 This document is relating to the following products: WE865DUA000-001 Reproduction forbidden without Telit Communications S.p.A.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 Contents 1 Overview ...........................................................................................................................6 1.1 Related documents ................................................................................................................7 2 Mechanical description....................................................................................................8 3 Pin-out...................................
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 9.1.4 Pin table ......................................................................................................................................... 39 10 Mounting the WE865-DUAL on the application board ................................................40 10.1 Stencil....................................................................................................................................40 10.2 PCB pad design .........................
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 DISCLAIMER The information contained in this document is proprietary information of Telit Communications S.p.A. including its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other than the Officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior written consent of Telit, is strictly prohibited.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 1 Overview This document is a user guide for developing a wireless application which integrates the Telit WE865DUAL with the GE863-PRO3 GSM/GPRS module creating a unique solution for a short and long range. This document cannot embrace the whole hardware solutions and products that may be designed. The information given is a guide line and a starting point for properly developing products with the Telit WE865-DUAL module.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 1.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 2 Mechanical description The Telit WE865-DUAL module overall dimensions are: • • • • Length: Width: Thickness: Weight 22.15 mm (max) 22.15 mm (max) 3.48 mm (max) 3.5 g Figure 1 Reproduction forbidden without Telit Communications S.p.A.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 Figure 2 (Bottom side) Reproduction forbidden without Telit Communications S.p.A.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 3 Pin-out 3.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 Ball Signal I/O Function A7 N.C. A8 N.C. B4 N.C. B5 N.C. B6 N.C. B7 N.C. B8 N.C. C5 N.C. C6 N.C. C8 N.C. D3 N.C. D4 N.C. D6 N.C. D7 N.C. D8 N.C. E3 N.C. E4 N.C. E6 N.C. E8 N.C. F4 N.C. F5 N.C. F6 N.C. F7 N.C. F8 N.C. G2 N.C. G6 N.C. G7 N.C. G8 N.C. H1 N.C. H2 N.C. H4 H7 N.C. N.C. H8 N.C. Internal PULL UP/DOWN Type Table 1 Reproduction forbidden without Telit Communications S.p.A.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 3.2 Ball grid A B C D E F G H 1 SDIO[0] EN_A* MR_RESET* EN_B* VDD VCC_A GND NC 2 SDIO[2] SDIO[1] GND RESET VDD VCC_A NC NC 3 SDIO_CLK SDIO[3] TEST_1 NC NC VCC_A GND GND 4 SDIO_CMD NC TEST_2 NC NC NC GND NC 5 NC NC TEST_3 TEST_4 GND NC GND RF_ANT 6 NC NC NC NC NC NC NC GND 7 NC NC GND NC GND NC NC NC 8 NC NC NC NC NC NC NC NC Table 2 NOTE: The drawing above is a top view.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 4 Electrical description The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design. 4.1 Power supply Powering of the module: • wide range voltage operation from 3.4V up to 4.2V (typical voltage 3.8V) the same as for GE863-PRO3.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 3.8 V (typ) WE865-DUAL VCC_A (F1) VCC_A (F2) VCC_A (F3) VDD (E1) VDD (E2) Figure 3 The table below shows the operating and absolute voltage ranges. VOLTAGE RANGES @ 25 °C Operating range Min [V] Typ [V] Max [V] 3.4 3.8 4.2 Table 4 Reproduction forbidden without Telit Communications S.p.A.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 4.1.1.1 Current consumption CURRENT CONSUMPTION @ 3.8V at 25 °C Operating mode Continuous Receive Continuous Transmit (maximum output power) Stand-by (receive beacons every 100 ms) Deep Sleep Shut-down mode Typ 100 180 5 3 <1 Unit mA mA mA mA mA Table 5 NOTE: continuous receive and transmit mode measures were taken at channel 6. 4.1.1.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 VOLTAGE LEVELS @ 25 °C VIL SIGNAL Min [V] Max [V] EN_A*, EN_B* 0 0.20 Table 7 EN_A* WE865-DUAL EN_B* Figure 4 4.2 Power supply design guidelines The power supply circuitry is a very important part in the full product design and it strongly affects the product overall performances, hence read carefully the requirements and the guidelines that will follow for a proper design.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 4.2.1 +5V input source A linear regulator can be used to generate the 3.8V output voltage. When using a linear regulator, a proper heat sink shall be provided in order to dissipate the generated power. A protection diode should be inserted close to the power input, in order to save the WE865-DUAL from power polarity inversion. This can be the same diode as for spike protection. The figure below shows a possible solution for the switching power supply.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 4.2.2 +12V input source Due to the big difference between the input source and the desired output voltage, a linear voltage regulator is not suited and not recommended. A switching power supply will be preferable because of its better efficiency especially in presence of peak current load. When using a switching regulator, 500 kHz switching frequency (or more) is preferable because of its smaller inductor size and its faster transient response.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 Figure 6 Reproduction forbidden without Telit Communications S.p.A.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 4.2.3 Battery source The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V, thus a single 3.7V Li-Ion cell battery type is suited for supplying the power to the WE865-DUAL module. Please refer to GE863-PRO3 electrical design guidelines for further information regarding type and battery usage.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 4.3.1 Reset An active high host reset (RESET, ball D2), allowing the WE865-DUAL to be reset by an external device (host). This pin is internally pulled-down, do not drive the signal during normal operation. The signal must be asserted for a period greater than 1ms. VOLTAGE LEVELS @ 25 °C VIH Min [V] 2,0 Max [V] 3,0 Remark - Table 9 WE865-DUAL RESET Figure 7 Reproduction forbidden without Telit Communications S.p.A.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 4.3.2 Manual reset An active low manual reset (MR_RESET*, ball C1), see the table below for the allowed voltage levels. As the pin is internally pulled-up, do not drive the signal during normal operation. The signal must be asserted for a period greater than 1ms. VOLTAGE LEVELS @ 25 °C VIL Min [V] -0,3 Max [V] 0,825 Remark Table 10 WE865-DUAL MR_RESET* Figure 8 Reproduction forbidden without Telit Communications S.p.A.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 4.4 SDIO signals A 4-data bit SDIO interface is available on the WE865-DUAL that must be connected to the host processor (Telit GE863-PRO3). WE865-DUAL SDIO voltage levels are fully compatible with the GE863-PRO3 I/O voltage levels. 47 Ohm series resistor on each SDIO line and 12pF capacitor on clock line must be inserted in order to avoid noise (see Electrical design guidelines chapter). Refer to §8.2.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 5 Thermal design guidelines The thermal design for the power supply heat sink should be done taking into account the current consumption involved in the appropriate power supply configuration. Please refer to §4.1.1.1 for detailed information on the current consumption. Reproduction forbidden without Telit Communications S.p.A.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 6 PCB layout design guidelines In case of implementing the input power supply circuitry as described in the previous §4.2.2, the PCB traces connecting the switching output to the inductor and the switching diode must be as short as possible. It is recommended to place the inductor and the diode very close to the power switching IC. This is done in order to reduce the radiated field (noise) of the switching frequency (100-500 kHz usually).
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 7 Antenna The antenna connection and board layout design are the most important part in the full product design and they strongly reflect on the product overall performances, hence read carefully and follow the requirements and the guidelines for a proper design. 7.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 This transmission line shall fulfill the following requirements: ANTENNA LINE ON PCB REQUIREMENTS Impedance [Ohm] 50 Maximum Attenuation [dB] 0.3 Coupling with other signals is not allowed Table 13 7.2 Wi-Fi antenna PCB trace guidelines • • • • • • • • • • Ensure that the antenna line impedance is 50 ohm. Keep the antenna line on the PCB as short as possible in order to limit losses.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 7.3 Wi-Fi antenna installation guidelines • • • • Install the antenna in a place covered by the Wi-Fi signal. The antenna must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Antenna shall not be installed inside metal cases. Antenna shall be installed also according Antenna manufacturer instructions.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 8 Integration with the GE863-PRO3 Figure 9 (Block diagram) NOTE: It is mandatory to leave available the TEST lines in the customer design: • TEST_1 • TEST_2 • TEST_3 • TEST_4 Reproduction forbidden without Telit Communications S.p.A.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 8.1 Power supply When integrating the WE865-DUAL with the Telit GE863-PRO3 module, as described in previous chapters a 3.8V (typ) voltage must be provided to the WE865-DUAL. The WE865-DUAL power enable signals (EN_A* and EN_B*) must be connected together and be driven by the GE863-PRO3 GPIO PC29 (ball F5) through a N-channel MOSFET.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 8.2 SDIO signals A 4-data bit SDIO interface is available on the WE865-DUAL that must be connected to the host processor (Telit GE863-PRO3). The WE865-DUAL SDIO voltage levels are fully compatible with the GE863-PRO3 I/O voltage levels. 47 Ohm series resistor on each SDIO line and 12pF capacitor on clock line must be inserted in order to avoid noise (see Electrical design guidelines chapter). Refer to block diagram in Figure 7.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 9 WE865-DUAL - Evaluation kit The WE865-DUAL can be provided with an evaluation/testing kit. The kit consists of: • • EVK-PRO3 evaluation kit for GE863-PRO3 module (EVK-PRO3 main board + GE863-PRO3 interface board) WE865-DUAL interface board In such a case, the WE865-DUAL module is directly soldered on its interface board. The figure below shows how the boards must be assembled in order to allow the system working.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 GE863-PRO3 WE865-DUAL interface board WE865-DUAL EVK-PRO3 Figure 13 Reproduction forbidden without Telit Communications S.p.A.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 EVK-PRO3 WE865-DUAL interface board WE865-DUAL GE863-PRO3 Figure 14 Reproduction forbidden without Telit Communications S.p.A.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 9.1 WE865-DUAL Interface board 9.1.1 Mechanical description Figure 15 Reproduction forbidden without Telit Communications S.p.A.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 9.1.2 Main components Main components TOP side list: WE865-DUAL module PL101: 2 pin jumper PL102: 2 pin jumper SW101: Reset button – Push to drive MR_RESET* low) SO104: RF connector (alternative to AT101) PL103: 5 pin header - SPI for test Figure 16 Reproduction forbidden without Telit Communications S.p.A.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 Main components BOTTOM side list: SO101: SO102: SO103: Interface connector Interface connector Interface connector Figure 17 Reproduction forbidden without Telit Communications S.p.A.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 9.1.3 Jumpers settings The figure below shows the PL101 and PL102 jumpers on the TOP side in the interface board Figure 18 PL101 - Short the jumper to drive EN_A* low PL102 - Short the jumper to drive EN_B* low Reproduction forbidden without Telit Communications S.p.A.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 9.1.4 Pin table Pin n.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 10 Mounting the WE865-DUAL on the application board The Telit WE865-DUAL module has been designed in order to be compliant with a standard lead-free SMT process. 10.1 Stencil Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120μm. 10.2 PCB pad design "Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 Figure 20 Recommendations for PCB pad dimensions Dimension Ball pitch Solder resist opening diameter A Metal PAD diameter B Value [mm] 2 1,150 1 +/- 0,05 Table 15 Placement of microvias not covered by solder resist is not recommended inside the “Solder resist Opening”,unless the microvia carry the same signal of the pad itself. Reproduction forbidden without Telit Communications S.p.A.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 Figure 21 Holes in pad are allowed only for blind holes and not for through holes. Recommendations for PCB pad surfaces: Finish Layer tickness [um] Properties Electro-less Ni / Immersion Au 3-7 / 0,05-0,15 good solder ability protection, high shear force values Table 16 The PCB must be able to resist the higher temperatures, which are occurring at the lead-free process. This issue should be discussed with the PCB-supplier.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 10.3 Solder paste Lead free Solder paste Sn / Ag / Cu Table 17 10.4 Solder reflow The following is the recommended solder reflow profile Figure 22 Reproduction forbidden without Telit Communications S.p.A.
WE865-DUAL HW User Guide 1vv0300787 Rev.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 11 Moisture sensitivity The level of moisture sensibility of Telit WE865-DUAL modules is “3”, according with standard IPC/JEDEC J-STD-020, take care of all the relative requirements for using this kind of components.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 12 Conformity assessment issues Assessment of the final product must be made against the Essential requirements of the R&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, and any relevant Article 3.3 requirements.
WE865-DUAL HW User Guide 1vv0300787 Rev. 1 - 03/10/08 13 Safety recommendations READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required.
WE865-DUAL HW User Guide 1vv0300787 Rev.
