User's Guide

UL865 Hardware User Guide
1VV0301050 Rev 2 – 2013-10-09
Recommendations for PCB pad surfaces:
Finish
Layer thickness [µm]
Properties
Electro-less Ni / Immersion Au
3 –7 / 0.03 – 0.15
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free
process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-
lead solder paste on the described surface plating is better compared to lead-free solder paste.
It is not necessary to panel the application PCB, however in that case it is suggested to use milled
contours and predrilled board breakouts; scoring or v-cut solutions are not recommended.
Lead free
Solder paste
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of
the modules after assembly.
Recommended solder reflow profile
TL
Tsmin
Tsmax
ts
tL
tp
ttp