User's Guide

UL865 Hardware User Guide
1VV0301050 Rev 2 – 2013-10-09
It is not recommended to place via or micro-via not covered by solder resist in an area of 0.3 mm
around the pads unless it carries the same signal of the pad itself (see following figure).
Holes in pad are allowed only for blind holes and not for through holes.
Inhibit area for micro-via
Solder resist opening