User's Manual

UE910 3G HARDWARE USER GUIDE 1vv0301171 Rev.3 • 2015-04-17 67 of 78
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9.4 Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120 µm.
9.5 Solder paste
Item
Lead Free
Solder Paste
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after
assembly.
9.6 Solder reflow
Recommended solder reflow profile: