User's Guide

UC864-E-AUTO / AWS-AUTO Hardware User Guide
1vv0300795 Rev.11 – 2010/11/18
Reproduction forbidden without Telit Communications S.p.A’s. written authorization - All Rights Reserved. Page 69 of 78
14.2. Clearance Area
14.3. Thermal Dissipation
To permit a better thermal dissipation it is suggested to use a Thermal conductive
material between the module and the application PCB.
Suggested types are Bergquist (Two parts) GAP filler 3500 or GAP Filler 1500
Clearance area for SMT
Components