User's Guide
UC864-E-AUTO / AWS-AUTO Hardware User Guide
1vv0300795 Rev.11 – 2010/11/18
Reproduction forbidden without Telit Communications S.p.A’s. written authorization - All Rights Reserved. Page 67 of 78
14.1. Application PCB Layout
To obtain the best thermal dissipation it is suggested to design the host PCB as in the
below image where a Ground area has been created below the module.
Bottom side
Top View