User's Manual

Telit TRIZIUM Product Description
80264ST10007a Rev. 4– 09/09/04
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2.17.5 Solder reflow
The following is the recommended solder reflow profile
NOTE : This is an ideal profile, and actual conditions obtained in any specific reflow oven will
vary. This profile is based on convection or RF plus forced convection heating.
NOTICE: Trizium module can accept only one reflow process
300
200
100
0
0
100 200 300
Time (sec)
Temperature (ºC)