User's Guide

ATOP3.5G Product Description
80447ST10636A rev.10 – 2015-03-03
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Reserved. Page 55 of 66
Mod. 0808 2011-07 Rev.2
19 Soldering
The ATOP 3.5G (OM12030) can be assembled using a standard Surface Mount Technology
(SMT) reflow process in a convection oven. Figure 14 and Table 34 indicate the maximum and
minimum limits of the solder profile. The applied profile has to fit within these limits. This
temperature profile is based on the IPC/JEDEC joint industry standard J-STD-020C.
It is recommended to use a standard no-clean SAC solder paste for a lead free assembly process.
No cleaning should be applied during or after module soldering process.
Figure 14 Reflow profile
Table 34 Reflow profile parameters
Reflow condition Value Unit
ramp-up rate ()  3
°C/s
ramp-down rate ()  6
°C/s
preheat temperature (T
S
)
150 to 200 °C
preheat time (t
S
)
60 to 180 s
time to melting (t
M
)
6 to 35 s
time maintained above temperature (T
L
)
> 217 °C
time maintained above time (t
L
)
60 to 150 s
peak/classification temperature minimum (T
pmin
)
235 °C
peak/classification temperature maximum (T
pmax
)
250 °C
maximum time above 250 °C 10 s
maximum time from 25 °C to peak temperature 8 mn