User's Guide

ATOP3.5G Product Description
80447ST10636A rev.10 – 2015-03-03
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights
Reserved. Page 54 of 66
Mod. 0808 2011-07 Rev.2
18 Package outline
ATOP 3.5G is a 33  33  3.35 mm laminate based module with a metal cover and a Land Grid
Array (LGA) at the bottom side of the product. The pad size is
0.8 mm with a 1.6 mm pitch.
Figure 13 ATOP 3.5G package outline