User's Guide

ATOP3.5G Product Description
80447ST10636A rev.10 – 2015-03-03
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Reserved. Page 53 of 66
Mod. 0808 2011-07 Rev.2
17 Packing information
ATOP 3.5G modules are packed in trays or as tape & reel. Before packing and shipping, trays and reels are
dry baked for 16 hours at 125 °C, according to IPC/JEDEC J-STD-033B.1.
ATOP 3.5G has been tested according to IPC/JEDEC J-STD 020D and is classified as Moisture Sensitivity
Level 3 (MSL3).
17.1 Footprint information for reflow soldering
The PCB footprint design is a copy of the metal LGA pattern at the bottom side of the ATOP package.
Figure 12 ATOP 3.5G footprint