User's Guide

ATOP3.5G Product Description
80447ST10636A rev.10 – 2015-03-03
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Reserved. Page 51 of 66
Mod. 0808 2011-07 Rev.2
Test Abbreviation Conditions Description
Temperature cycling TMCL
T
amb
= 40 °C to +105 °C
Acceleration test to investigate thermo-mechanical
failure modes (like delamination, die lift, wire break,
bond ball lift, die crack, pattern shift, and passivation
crack) due to both ambient and internal temperature
changes during device or application power-up and
switching OFF as well as ambient storage.
Vibration VIBR ISO 17650, Random
RMS
2.78G, T
amb
= 40 °C to
+85 °C
Test used to determine the ability of the device to
withstand repetitive vibration as a result of motion
produced by transportation or field operation.
Board level test methods
Board level temperature
cycling
BL-TMCL
T
amb
= 40 °C to +125 °C
Acceleration test to investigate thermo-mechanical
failure modes (like solder fatigue) at the interconnect
between the device and the printed circuit board due
to both ambient and internal temperature changes
during device and application power-up and
switching OFF as well as ambient storage.
System level ESD ESDS IEC61000-4-2, ESD gun