User Guide

ME910G1 HW Design Guide
1VV0301593 Rev.7 Page 76 of 98 2021-02-02
Note: All temperatures refer to topside of the package, measured on
the package body surface
Warning: THE ME910G1 MODULE WITHSTANDS ONE REFLOW
PROCESS ONLY.
Warning: The above solder reflow profile represents the typical SAC
reflow limits and does not guarantee adequate adherence of the
module to the customer application throughout the temperature
range. Customer must optimize the reflow profile depending on the
overall system taking into account such factors as thermal mass and
warpage.
Inspection
An inspection of the solder joint between the solder pads of the Telit module and the
application PCB should be performed. The best visual inspection tool for inspection of the
Telit module solder joints on the PCB is a transmission X-ray, which can identify defects
such as solder bridging, shorts, opens, and large voids (Note: small voids in large solder
joints are not detrimental to the reliability of the solder joint).