ME910G1 HW Design Guide 1VV0301593 Rev.
ME910G1 HW Design Guide APPLICABILITY TABLE PRODUCTS ME910G1-W1 ME910G1-WW ME910G1-WWV 1VV0301593 Rev.
ME910G1 HW Design Guide CONTENTS APPLICABILITY TABLE 2 CONTENTS 3 1. 8 2. 3. 4.
ME910G1 HW Design Guide 5.
ME910G1 HW Design Guide 6. 7. Indication of network service availability 54 External SIM Holder 55 ADC Converter 55 RF SECTION 57 Antenna requirements 57 PCB Design guidelines 58 PCB Guidelines in case of FCC Certification 59 Transmission line design 60 Transmission Line Measurements 60 Antenna Installation Guidelines 62 AUDIO SECTION 63 Electrical Characteristics 8. 9.
ME910G1 HW Design Guide 11. 12.
ME910G1 HW Design Guide Copyrights 91 Computer Software Copyrights 91 Usage and Disclosure Restrictions 92 License Agreements 92 Copyrighted Materials 92 High Risk Materials 92 Trademarks 93 3rd Party Rights 93 Waiwer of Liability 93 Safety Recommendations 94 14. GLOSSARY 95 15. DOCUMENT HISTORY 96 1VV0301593 Rev.
ME910G1 HW Design Guide 1. INTRODUCTION Scope Scope of this document is to give a description of some hardware solutions useful for developing a product with the Telit ME910G1 module. Audience This document is intended for Telit customers, in particular system integrators, who are going to implement their applications using our ME910G1 modules.
ME910G1 HW Design Guide Symbol Convention Danger: This information MUST be followed, or catastrophic equipment failure or personal injury may occur. Warning: Alerts the user on important steps about the module integration. Note/Tip: Provides advice and suggestions that may be useful when integrating the module. Electro-static Discharge: Notifies the user to take proper grounding precautions before handling the product. Table 1: Symbol Conventions All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
ME910G1 HW Design Guide 2. GENERAL PRODUCT DESCRIPTION Overview The ME910G1 module is a CATM/ NBIoT communication product which allows integrators to plan on availability for even the longest lifecycle applications, highly recommended for new designs specified for worldwide coverage.
ME910G1 HW Design Guide Note: “B86” is not a 3GPP band, it means the following: UL range: 787-788 MHz, DL range: 757-758 MHz that is available only in module where AT#BNDOPTIONS command contains the string B86. i.e.
ME910G1 HW Design Guide TX Output Power ME910G1-W1 Band Mode 3GPP Class RF power (dBm) Nominal* B1, B2, B3, B4, B5, B8, B12, B13, B14, B18, B19, B20, B25, B26, B27, B28, B66, B85 (LTE) CAT-M1 5 21 B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B28, B66, B71, B85, B86 (LTE) CAT-NB2 5 21 Table 4: Transmission Output power ME910G1-WW and ME910G1-WWV Band Mode GSM/GPRS Class RF power (dBm) Nominal* 4 32.5 E2 27 1 29.
ME910G1 HW Design Guide RX Sensitivity ME910G1-W1 REFsens (dBm) Typical REFsens (dBm)* 3GPP limit CATM1 / Band1 -107.6 -102.7 CAT M1 / Band2 -108.0 -100.3 CAT M1 / Band3 -107.6 -99.3 CAT M1 / Band4 -107.8 -102.3 CAT M1 / Band5 -107.9 -100.8 CAT M1 / Band8 -107.8 -99.8 CAT M1 / Band12 -107.8 -99.3 CAT M1 / Band13 -108.0 -99.3 CAT M1 / Band18 -108.0 -102.3 CAT M1 / Band19 -108.0 -102.3 CAT M1 / Band20 -107.8 -99.8 CAT M1 / Band25 -108.0 - CAT M1 / Band26 -108.0 -100.
ME910G1 HW Design Guide REFsens (dBm) Typical REFsens (dBm)* 3GPP limit CAT NB2 / Band20 -116.6 -108.2 CAT NB2 / Band25 -116.8 - CAT NB2 / Band26 -116.8 -108.2 CAT NB2 / Band28 -116.9 -108.2 CAT NB2 / Band66 -116.6 -108.2 CAT NB2 / Band71 -115.4 - CAT NB2 / Band85 -116.8 - Band Table 6: RX Sensitivity ME910G1-W1 * 3GPP TS 36.521-1 Release 15 Minimum performance requirement 1VV0301593 Rev.
ME910G1 HW Design Guide ME910G1-WW and ME910G1-WWV REFsens (dBm) Typical 3GPP REFsens (dBm)* 3GPP limit CATM1 / Band1 -106.3 -102.7 CAT M1 / Band2 -107.3 -100.3 CAT M1 / Band3 -106.6 -99.3 CAT M1 / Band4 -106.7 -102.3 CAT M1 / Band5 -107.1 -100.8 CAT M1 / Band8 -107.3 -99.8 CAT M1 / Band12 -106.5 -99.3 CAT M1 / Band13 -107.9 -99.3 CAT M1 / Band18 -107.6 -102.3 CAT M1 / Band19 -106.8 -102.3 CAT M1 / Band20 -107.4 -99.8 CAT M1 / Band25 -107.0 - CAT M1 / Band26 -107.
ME910G1 HW Design Guide REFsens (dBm) Typical 3GPP REFsens (dBm)* 3GPP limit CAT NB2 / Band26 -116.1 -108.2 CAT NB2 / Band28 -116.8 -108.2 CAT NB2 / Band66 -115.6 -108.2 CAT NB2 / Band71 -113.7 - CAT NB2 / Band85 -116.0 - Band Table 7: RX Sensitivity ME910G1-WW and ME910G1-WWV * 3GPP TS 36.521-1 Release 15 Minimum performance requirement 1VV0301593 Rev.
ME910G1 HW Design Guide Mechanical Specifications Dimensions The overall dimensions of ME910G1-W1, ME910G1-WW and ME910G1-WWV are: • Length: 28.2 mm • Width: 28.2 mm • Thickness: 2.4 mm Weight The nominal weight of the ME910G1-W1 is 3.5 gr. The nominal weight of the ME910G1-WW and ME910G1-WW is 4 gr. Temperature Range Temperature Range Note Operating Temperature Range –40°C to +85°C The module is fully functional (*) and compliant according to regulatory standards.
ME910G1 HW Design Guide 3. PINS ALLOCATION Pin-out Pin Signal I/O Function Type Comment USB HS 2.0 COMMUNICATION PORT (FW upgrade and Data) B15 USB_D+ I/O USB differential Data (+) C15 USB_D- I/O USB differential Data (-) A13 VUSB I Enable pin for the internal USB transceiver. Asynchronous Serial Port (USIF0) 5 / 3V Internal PD (100K) (FW upgrade and Data with Flow Control) N15 C103/TXD I Serial data input from DTE CMOS 1.8V M15 C104/RXD O Serial data output to DTE CMOS 1.
ME910G1 HW Design Guide Pin Signal I/O Function Type B6 DVI_RX I Digital Audio Interface (RX) 1.8V B7 DVI_TX I/O Digital Audio Interface (TX) 1.8V B8 DVI_CLK I/O Digital Audio Interface (CLK) 1.8V D15 SPI_MOSI I/O SPI MOSI CMOS 1.8V E15 SPI_MISO I/O SPI_MISO CMOS 1.8V F15 SPI_CLK I/O SPI Clock CMOS 1.8V H14 SPI_CS I/O SPI Chip Select CMOS 1.8V GPIO_01 /STAT LED CMOS 1.
ME910G1 HW Design Guide Pin K1 Signal ANTENNA I/O I/O Function Type LTE Antenna (50 ohm) RF Comment GNSS Section R9 ANT_GNSS I GNSS Antenna (50 ohm) RF R7 GNSS_LNA_EN O External GNSS LNA Enable CMOS 1.8V Miscellaneous Functions R13 HW_SHUTDOWN* I HW Unconditional Shutdown VBATT Active low R12 ON_OFF*/WAKE* I Input command for power ON and to wake from deep sleep mode 1.8V Active low R11 VAUX/PWRMON O Supply Output for external accessories / Power ON Monitor 1.
ME910G1 HW Design Guide Pin Signal I/O Function Type K2 GND - Ground Power L2 GND - Ground Power R2 GND - Ground Power M3 GND - Ground Power N3 GND - Ground Power P3 GND - Ground Power R3 GND - Ground Power D4 GND - Ground Power M4 GND - Ground Power N4 GND - Ground Power P4 GND - Ground Power R4 GND - Ground Power N5 GND - Ground Power P5 GND - Ground Power R5 GND - Ground Power N6 GND - Ground Power P6 GND - Ground P
ME910G1 HW Design Guide Pin Signal I/O Function B2 RESERVED - RESERVED C2 RESERVED - RESERVED D2 RESERVED - RESERVED B3 RESERVED - RESERVED C3 RESERVED - RESERVED D3 RESERVED - RESERVED E3 RESERVED - RESERVED F3 RESERVED - RESERVED G3 RESERVED - RESERVED K3 RESERVED - RESERVED L3 RESERVED - RESERVED B4 RESERVED - RESERVED C4 RESERVED - RESERVED B5 RESERVED - RESERVED C5 RESERVED - RESERVED C6 RESERVED - RESERVED C7 RESERVED - RESERVED
ME910G1 HW Design Guide Pin Signal I/O Function K14 RESERVED - RESERVED N13 RESERVED - RESERVED L13 RESERVED - RESERVED J13 RESERVED - RESERVED M13 RESERVED - RESERVED K13 RESERVED - RESERVED H13 RESERVED - RESERVED G13 RESERVED - RESERVED F13 RESERVED - RESERVED B11 RESERVED - RESERVED B10 RESERVED - RESERVED A9 RESERVED - RESERVED A8 RESERVED - RESERVED E13 RESERVED - RESERVED D13 RESERVED - RESERVED D14 RESERVED - RESERVED A14 RESERVED
ME910G1 HW Design Guide LGA Pads Layout TOP VIEW 1 A 2 HW_KE Y B C GND 10 WIFI GND 11 12 GND GND 13 14 BT GND 15 16 GND GND 17 18 19 GND GND IO3 IO4 IO5 A RES IO6 B RES GND RES GND GND GND RES GNSS_ ON SD_D3 USB_B OOT SIM_CL K GND GND WAKE SIM_IO SD_D1 SD_CLK GND SIM_RS T GND PSM SD_D0 GND SIM_VC C RST USB_VB US GND HID3 HID4 POW_G ND IO1 IO2 ADC GND VBATT/ VBATT_ PA POW_G ND VBATT/ VBATT_ PA AA 1 2 3 CS POW_G ND 4 5 MISO CLK 6 7
ME910G1 HW Design Guide 4. POWER SUPPLY The power supply circuitry and the board layout are a very important part in the full product design and they strongly reflect on the product overall performances, so the requirements and the guidelines that will follow should be read carefully for a proper design. Power Supply Requirements The external power supply must be connected to VBATT and VBATT_PA pads and must fulfil the following requirements: Power Supply Value Nominal Supply Voltage 3.
ME910G1 HW Design Guide Note: The application’s power supply section must be designed with care to avoid an excessive voltage drop during transmission peak current absorptions. If the voltage drops beyond the limits of the Extended Operating Voltage range, an unintentional module power off can occur. Note: When turning on the modem, the voltage must be at least VBATTmin.
ME910G1 HW Design Guide Mode Measure* (Typical) GPS Mode Description (mA) Acquisition Active State (GNSS ON, CFUN=4) GPS+GLO, DPO on DWELL=280ms 22 Navigation Acquisition Active State (GNSS ON, CFUN=5 eDRX) GPS+GLO, DPO off 69.3 55.9 GPS+GLO, DPO off 68.5 GPS+GLO, DPO off 15.
ME910G1 HW Design Guide ME910G1-WW and ME910G1-WWV Connected Mode Measure (Typical) Mode Connected mode CATM NBIoT GPRS Mode Description Average (mA) Peak (mA) 380 1100 1 RB, RMC, TBS=5, QPSK, 23dBm, Band 85, 28, 12 320 900 1 RB, RMC, TBS=5, QPSK,23dBm, Band 13, 26, 5, 18, 19, 20, 8 305 800 1 RB, RMC, TBS=5, QPSK, 23dBm, Band 3, 2, 25, 4, 1, 66 240 335 3.75KHz, 1 SC, RU 32ms, TBS=0, BPSK, 20dBm, Band 71 600 1000 3.75KHz, 1 SC, RU 32ms, TBS=0, BPSK, 23dBm, Band 85, 28, 12 500 850 3.
ME910G1 HW Design Guide General Design Rules The main guidelines for the Power Supply Design include three different design steps: • the electrical design of the power supply • the thermal design • the PCB layout Electrical Design Guidelines of the power supply The electrical design of the power supply strongly depends on the power source where this power is drained.
ME910G1 HW Design Guide Figure 2: An example of linear regulator with 5V input +12V Source Power Supply Design Guidelines • The desired output for the power supply is 3.8V, so due to the big difference between the input source and the desired output, a linear regulator is not suitable and shall not be used. A switching power supply will be preferable because of its better efficiency.
ME910G1 HW Design Guide Figure 3: An example of switching regulator with 12V input Battery Source Power Supply Design Guidelines The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the power to the Telit ME910G1 module. • A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100μF tantalum capacitor is usually suited.
ME910G1 HW Design Guide Note: Make PCB design in order to have the best connection of GND pads to large surfaces of copper. Note: The ME910G1 includes a function to prevent overheating. Power Supply PCB layout Guidelines As seen on the guidelines for electrical design, the power supply shall have a low ESR capacitor on the output to cut the current peaks on the input to protect the supply from spikes. The placement of this component is crucial for the correct working of the circuitry.
ME910G1 HW Design Guide overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier. • The power supply input cables should be kept separate from noise sensitive lines such as microphone/earphone cables. • The insertion of EMI filter on VBATT pins is suggested in those designs where antenna is placed close to battery or supply lines. A ferrite bead like Murata BLM18EG101TN1 or Taiyo Yuden P/N FBMH1608HM101 can be used for this purpose.
ME910G1 HW Design Guide VAUX Power Output A regulated power supply output is provided to supply small devices from the module, like: level translators, audio codec, sensors, and others. Pin R11 can be used also as PWRMON (module powered ON indication) function, because is always active when the module is powered ON and cannot be set to LOW level by any AT command. Host can only detect deep sleep mode by monitoring of VAUX/PWRMON output pin, since there is no pin dedicated to PSM status indicator.
ME910G1 HW Design Guide 5. DIGITAL SECTION ME910G1 has four main operation states: • OFF state: Vbatt is applied and only RTC is running. Baseband is switched OFF and the only change possible is the ON state. • ON state: baseband is fully switched on and ME910G1 is ready to accept AT commands. ME910G1 can be idle or connected. • Sleep mode state: main baseband processor is intermittently switched ON and AT commands can be processed with some latency. ME910G1 is idle with low current consumption.
ME910G1 HW Design Guide Power On To turn on the ME910G1 the pad ON_OFF*/WAKE* must be tied low for at least 5 second and then released. The maximum current that can be drained from the ON_OFF*/WAKE* pad is 0,1 mA. ON_OFF*/WAKE* pad can make an asynchronous wakeup of the system from the PSM Mode, before the scheduled event of timer T3412 expired. To make asynchronous exit from PSM mode ON_OFF*/WAKE* pin must be set LOW for at least 5 seconds.
ME910G1 HW Design Guide A flow chart showing the proper turn on procedure is displayed below: “Modem ON Proc” START N VBATT>VBATTmin? Y Y PWRMON=ON ? N ON_OFF*/WAKE* = LOW GO TO “HW Shutdown Unconditional” Delay = 5 sec ON_OFF*/WAKE*= HIGH PWRMON=ON ? N Y Delay = 1 sec GO TO “Start AT Commands”” “Modem ON Proc” END Figure 6: Turn on procedure flow chart 1VV0301593 Rev.
ME910G1 HW Design Guide A flow chart showing the AT commands managing procedure is displayed below: “Start AT CMD” START Delay = 300 msec Enter AT AT answer in 1 sec ? N GO TO “HW Shutdown Unconditional” Y GO TO “Modem ON Proc.
ME910G1 HW Design Guide For example: 1- Let's assume you need to drive the ON_OFF*/WAKE* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT1): 2- Let's assume you need to drive the ON_OFF*/WAKE* pad directly with an ON/OFF button: Warning: It is recommended to set the ON_OFF*/WAKE* line LOW to power on the module only after VBATT is higher than 3.20V.
ME910G1 HW Design Guide Power Off Turning off of the device can be done in two ways: • via AT command (see ME910G1 Software User Guide, AT#SHDN) • pin ON_OFF*/WAKE* for at least 3 seconds Either ways, the device issues a detach request to network informing that the device will not be reachable any more. Note: To check if the device has been powered off or IN PSM mode, the hardware line PWRMON must be monitored. The device is powered off when PWRMON goes low.
ME910G1 HW Design Guide The following flow chart shows the proper turn off procedure: “Modem OFF Proc.” START N PWRMON=ON? Y Key AT OFF Mode ON_OFF*/WAKE* = LOW Delay >= 3 sec AT#SHDN ON_OFF*/WAKE* = HIGH N PWRMON=ON? “Modem OFF Proc.” END Y N Looping for more than 15s? Y GO TO “HW SHUTDOWN Unconditional” Figure 8: turn off procedure flow chart 1VV0301593 Rev.
ME910G1 HW Design Guide Wake from deep sleep mode ME910G1 supports Power Saving Mode (PSM) functionality defined in 3GPP Release 12. When Periodic Update Timer expires, ME910G1 power off until the next scheduled wakeup time. Asynchronous event controlled by host can wake up from deep sleep mode by asserting ON_OFF*/WAKE* pin LOW for at least 5 seconds. Host can detect deep sleep mode by polling VAUX/PWRMON pin if previously configured.
ME910G1 HW Design Guide A typical circuit is the following: Figure 9: typical circuit For example: Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2): Figure 10: typical circuit 1VV0301593 Rev.
ME910G1 HW Design Guide In the following flow chart the proper restart procedure is detailed: “HW SHUTDOWN Unconditional” START HW_SHUTDOWN* = LOW Delay = 1s Delay = 200ms Disconnect VBATT HW_SHUTDOWN* = HIGH PWRMON = ON Y N “HW SHUTDOWN Unconditional” END Figure 11: restart procedure flow chart Note: In order to avoid a back powering it is recommended to prevent any HIGH logic level signal from being applied to the digital pins of the ME910G1 when the module is powered off or during an ON-OFF tr
ME910G1 HW Design Guide Note: Do not use any pull up resistor on the HW_SHUTDOWN* line nor any totem pole digital output. Using pull up resistor may bring to latch up problems on the ME910G1 power regulator and improper functioning of the module. To proper power on again the module please refer to the related paragraph (“Power ON”) The unconditional hardware shutdown must always be implemented on the boards and should be used only as an emergency exit procedure.
ME910G1 HW Design Guide Example circuit: Figure 12: example circuit Note: Consider voltage drop under max current conditions when defining the voltage detector thereshold in order to avoid unwanted shutdown. The capacitor is rated with the following formula: Tip: Make the same plot during system verification to check timings and voltage levels. Fast Shut Down by Software The fast shut down can be triggered by AT command. 1VV0301593 Rev.
ME910G1 HW Design Guide Communication ports Note: It is suggested to add PCB test points at non-used module’s UART, UART_AUX and USB (for products that support USB), it can be useful to reflash, test and debug the application. Test points for UART or USB are fine, however we recommend placing the pads for a suitable connector to port, for convenient access for network certification testing and access during early development testing. The USB connector can be “DNP” until needed.
ME910G1 HW Design Guide SPI The ME910G1 Module is provided by a standard 3-wire master SPI interface + chip select control. The following table lists the available signals: PAD Signal I/O Function Type NOTE D15 SPI_MOSI O SPI MOSI CMOS 1.8V Shared with TX_AUX E15 SPI_MISO I SPI MISO CMOS 1.8V Shared with RX_AUX F15 SPI_CLK O SPI Clock CMOS 1.8V H14 SPI_CS O SPI Chip Select CMOS 1.
ME910G1 HW Design Guide Serial Ports The ME910G1 module is provided with by 2 Asynchronous serial ports: • MODEM SERIAL PORT 1 (Main) • MODEM SERIAL PORT 2 (Auxiliary) Several configurations can be designed for the serial port on the OEM hardware, but the most common are: • RS232 PC com port • microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit) • microcontroller UART @ 5V or other voltages different from 1.
ME910G1 HW Design Guide Note: According to V.24, some signal names are referred to the application side, therefore on the ME910G1 side these signal are on the opposite direction: TXD on the application side will be connected to the receive line (here named C103/TXD) RXD on the application side will be connected to the transmit line (here named C104/RXD). For a minimum implementation, only the TXD, RXD lines can be connected, the other lines can be left open provided a software flow control is implemented.
ME910G1 HW Design Guide RS232 level translation In order to interface the ME910G1 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required. This level translator must: • invert the electrical signal in both directions; • Change the level from 0/1.8V to +15/-15V. Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level translator.
ME910G1 HW Design Guide Figure 14: example circuitry The RS232 serial port lines are usually connected to a DB9 connector with the following layout: Figure 15: example RS232 serial port lines 1VV0301593 Rev.
ME910G1 HW Design Guide General purpose I/O The ME910G1 module is provided by a set of Configurable Digital Input / Output pins (CMOS 1.8V). Input pads can only be read; they report the digital value (high or low) present on the pad at the read time. The Output pads can only be written or queried and set the value of the pad output. An alternate function pad is internally controlled by the ME910G1 firmware and acts depending on the function implemented.
ME910G1 HW Design Guide Note: In order to avoid a back powering it is recommended to prevent any HIGH logic level signal from being applied to the digital pins of the ME910G1 when the module is powered off or during an ON/OFF transition. Refer to ME910G1 series AT command reference guide for GPIO pins configuration. Using a GPIO as OUTPUT The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware.
ME910G1 HW Design Guide In the following reference schematic for LED indicator, R3 must be calculated taking in account VBATT value and LED type: Figure 16: LED indicator reference schematic External SIM Holder Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a). ADC Converter The ME910G1 is provided by one AD converter. It is able to read a voltage level in the range of 0÷1.8 volts applied on the ADC pin input, store and convert it into 10 bit word.
ME910G1 HW Design Guide The ADC could be controlled using an AT command. The command is AT#ADC=1,2 The read value is expressed in mV Refer to SW User Guide or AT Commands Reference Guide for the full description of this function. 1VV0301593 Rev.
ME910G1 HW Design Guide 6. RF SECTION Antenna requirements The antenna connection and board layout design are the most important aspect in the full product design as they strongly affect the general performance of the product, so read carefully and follow the requirements and the guidelines for a proper design.
ME910G1 HW Design Guide PCB Design guidelines When using the ME910G1, since there's no antenna connector on the module, the antenna must be connected to the ME910G1 antenna pad (K1) by means of a transmission line implemented on the PCB.
ME910G1 HW Design Guide • place EM noisy devices as far as possible from ME910G1 antenna line; • keep the antenna line far away from the ME910G1 power supply lines; • if EM noisy devices (such as fast switching ICs, LCD and so on) are present on the PCB hosting the ME910, take care of the shielding of the antenna line by burying it in an inner layer of PCB and surrounding it with the Ground planes, or shield it with a metal frame cover.
ME910G1 HW Design Guide Transmission line design When designing the ME910G1 interface board, the placement of components was chosen properly, in order to keep the line length as short as possible, thus leading to the lowest possible power losses. A Grounded Coplanar Waveguide (G-CPW) line was chosen, since this kind of transmission line ensures good impedance control and can be implemented in an outer PCB layer as needed in this case. A SMA female connector has been used to feed the line.
ME910G1 HW Design Guide transmission line including the connector itself. During Return Loss / impedance measurements, the transmission line has been terminated to 50 Ω load.
ME910G1 HW Design Guide Figure 21: Insertion Loss of G-CPW line plus SMA connector Antenna Installation Guidelines • Install the antenna in a place covered by the LTE signal with CAT-M1 support. • The Antenna must not be installed inside metal cases. • The Antenna must be installed according Antenna manufacturer instructions. • The Antenna integration should optimize the Radiation Efficiency. Efficiency values > 50% are recommended on all frequency bands.
ME910G1 HW Design Guide 7. AUDIO SECTION The Telit digital audio interface (DVI) of the ME910G1 Module is based on the I2S serial bus interface standard. The audio port can be connected to the end device using digital interface, or via one of the several compliant codecs (in case an analog audio is needed).
ME910G1 HW Design Guide 8. GNSS SECTION The ME910G1 module includes a state-of-art receiver that can simultaneously search and track satellite signals from multiple satellite constellations. This multi-GNSS receiver uses the entire spectrum of GNSS systems available: GPS, GLONASS, BeiDou, Galileo, and QZSS. GNSS Signals Pin-out Pin Signal I/O Function R9 ANT_GNSS I GNSS Antenna (50 ohm) R7 GNSS_LNA_EN O GNSS External LNA Enable Type CMOS 1.
ME910G1 HW Design Guide • Keep the antenna line far away from GSM RF lines. • If there are noisy EM devices around the PCB hosting the module, such as fast switching ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes, or shielding it with a metal frame cover. • If there are not noisy EM devices around the PCB hosting the module, use a stripline on the superficial copper layer for the antenna line.
ME910G1 HW Design Guide GNSS Antenna Requirements GNSS active antenna must be used or integrated in the application. GNSS Antenna specification Item Value Frequency range 1559.0 ~ 1610.0 MHz Gain 15 ~ 30dB Impedance 50 ohm Noise Figure of LNA < 1.5 (recommended) DC supply voltage DC 1.8 ~ 3.3V VSWR ≤ 3:1 (recommended) Table 30: GNSS Antenna specification Note: In case of GNSS antenna placed close to module 15dB gain is enough, in case of long cable the gain has to be increased up to 30dB.
ME910G1 HW Design Guide The electrical characteristics of the GPS_LNA_EN signal are: Level Min Max Output High Level 1.6V 1.9V Output Low Level 0V 0.3V Table 31: Electrical characteristics of the GPS_LNA_EN Example of external antenna bias circuitry: Figure 23: External antenna bias circuitry example Be aware of max bias current in case of unwanted short on the antenna cable, since the decoupling inductor may be damaged. In case of LNA with 1.
ME910G1 HW Design Guide GNSS Characteristics The table below specifies the GNSS characteristics and expected performance: Typical Measurement Parameters Sensitivity TTFF Notes Tracking Sensitivity -159 dBm Navigation -155 dBm Cold Start -144 dBm Hot N/A It will be available in next revision Warm <30s GNSS Simulator test @-130dBm Cold <30s GNSS Simulator test @-130dBm Min Navigation update rate 1Hz CEP <2m Table 32: GNSS characteristics 1VV0301593 Rev.
ME910G1 HW Design Guide 9. MECHANICAL DESIGN Drawing PIN B1 Lead Free Alloy: Surface Finishing Ni/Au for all solder pads Dimensions in mm Figure 24: ME910G1 Mechanical Drawing 1VV0301593 Rev.
ME910G1 HW Design Guide 10. APPLICATION PCB DESIGN The ME910G1 modules have been designed in order to be compliant with a standard leadfree SMT process Recommended footprint for the application TOP VIEW Figure 25: Footprint 1VV0301593 Rev.
ME910G1 HW Design Guide SOLDER RESIST PATTERN (dimensions in mm) Figure 26:: Solder resist pattern TOP TRANSPARENT VIEW Figure 27: Top transparent view 1VV0301593 Rev.
ME910G1 HW Design Guide In order to easily rework the ME910G1 it is recommended to consider on the application a 1.5 mm placement inhibit area around the module. It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module. Note: In the customer application, the region under WIRING INHIBIT (see figure above) must be clear from signal or ground paths.
ME910G1 HW Design Guide Recommendations for PCB pad dimensions It is not recommended to place via or micro-via not covered by solder resist in an area of 0,3 mm around the pads unless it carries the same signal of the pad itself Inhibit area for micro-via Figure 29: Pad dimensions recommendations Holes in pad are allowed only for blind holes and not for through holes. Recommendations for PCB pad surfaces: Finish Electro-less Ni / Immersion Au Layer Thickness (um) 3 –7 / 0.05 – 0.
ME910G1 HW Design Guide transfer for FR-4 PCBs is to add thermal vias - plated through-holes (PTH) between the conductive layers. Vias are created by drilling holes and copper plating them, in the same way that a PTH or via is used for electrical interconnections between layers. A series of plated through-hole thermal vias, should be located in the GND area underneath Telit module of the PCB to provide a thermal connection from the PCB GND to additional metal layers of the PCB.
ME910G1 HW Design Guide Solder paste Various types and grades of solder paste can be used for surface mounting Telit modules. For leadfree applications, a Sn-Ag (SA) or Sn-Ag-Cu (SAC) solder paste can be used. Any Type 3 solder paste that is either water-soluble or no clean is acceptable. We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after assembly.
ME910G1 HW Design Guide Note: All temperatures refer to topside of the package, measured on the package body surface Warning: THE ME910G1 MODULE WITHSTANDS ONE REFLOW PROCESS ONLY. Warning: The above solder reflow profile represents the typical SAC reflow limits and does not guarantee adequate adherence of the module to the customer application throughout the temperature range.
ME910G1 HW Design Guide 11. PACKAGING Tray The ME910 modules are packaged on trays that can be used in SMT processes for pick & place handling.The first Marketing and Engineering samples of the ME910G1 series will be shipped with the current packaging of the xE910 modules (on trays of 20 pieces each).
ME910G1 HW Design Guide Figure 32: Tray dimensions 1VV0301593 Rev.
ME910G1 HW Design Guide Reel The ME910 can be packaged on reels of 200 pieces each. See figure for module positioning into the carrier. Figure 33: Module positioning into the carrier Carrier Tape detail Figure 34: Carrier Tape detail 1VV0301593 Rev.
ME910G1 HW Design Guide Reel detail Figure 35: Reel detail Figure 36: Detail 1VV0301593 Rev.
ME910G1 HW Design Guide Packaging detail Figure 37: Packaging detail Moisture sensitivity The ME910G1 is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).
ME910G1 HW Design Guide 12. CONFORMITY ASSESSMENT ISSUES Approvals summary Type Approval ME910G1-W1 ME910G1-WW ME910G1-WWV EU RED Yes Yes Yes US FCC Yes Yes Yes CA ISED Yes Yes Yes BRAZIL ANATEL - Yes - JAPAN JRF & JTBL - Yes - CHINA CCC - Ongoing - Table 35: Approvals summary RED approval RED Declaration of Conformity Hereby, Telit Communications S.p.A declares that the ME910G1-W1, ME910G1-WW and ME910G1-WWV Modules are in compliance with Directive 2014/53/EU.
ME910G1 HW Design Guide Max Gain for RED (dBi) Band ME910G1-W1 ME910G1-WW ME910G1-WWV GSM 900 --- --- TBD DCS 1800 --- --- TBD GPRS/EGPRS 900 --- 5.47 5.47 GPRS/EGPRS 1800 --- 9.34 9.34 FDD 1 14.84 11.84 11.84 FDD 3 14.33 11.33 11.33 FDD 8 11.45 8.45 8.45 FDD 20 11.20 8.20 8.20 FDD 28 10.47 7.47 7.47 Table 37: Max Gain for RED FCC and ISED approval/FCC et ISDE approbation FCC certificates The FCC Certificate is available here: https://www.fcc.
ME910G1 HW Design Guide FCC and ISED Regulatory notices/Avis réglementaires de FCC et ISDE Modification statement / Déclaration de modification Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment. Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur, quelle qu’en soit la nature.
ME910G1 HW Design Guide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
ME910G1 HW Design Guide Max Gain for FCC (dBi) Band ME910G1-W1 ME910G1-WW ME910G1-WWV GSM 850 --- --- 8.44 GSM 1900 --- --- 10.04 GPRS/EGPRS 850 --- 6.93 6.93 GPRS/EGPRS 1900 --- 10.42 10.42 FDD 2 11.0 12.01 12.01 FDD 4 8.0 12.01 12.01 FDD 5 12.4 9.41 9.41 FDD 12 11.6 8.70 8.70 FDD 13 12.1 9.16 9.16 FDD 25 11.0 12.01 12.01 FDD 26 12.3 9.36 9.36 FDD 66 8.0 12.01 12.01 FDD 71 11.4 11.47 11.47 FDD 85 11.6 8.69 8.69 FDD 86 12.
ME910G1 HW Design Guide Gain maximum pour ISED (dBi) / Gain maximum pour ISDE (dBi) Bande ME910G1-W1 ME910G1-WW ME910G1-WWV GSM 850 5.15 GSM 1900 10.04 GPRS/EGPRS 850 --- 3.64 3.64 GPRS/EGPRS 1900 --- 5.13 5.13 FDD 2 11.0 8.52 8.52 FDD 4 8.0 8.29 8.29 FDD 5 9.1 6.12 6.12 FDD 12 8.6 5.63 5.63 FDD 13 8.9 5.95 5.95 FDD 25 11.0 8.52 8.52 FDD 26 9.0 6.09 6.09 FDD 66 8.0 8.29 8.29 FDD 71 8.4 8.48 8.48 FDD 85 8.6 5.63 5.
ME910G1 HW Design Guide ISED label and compliance information/ Étiquette et informations de conformité ISDE The host product shall be properly labelled to identify the modules within the host product.
ME910G1 HW Design Guide If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093 and IC RSS-102. Le module a été évalué dans des conditions autonomes mobiles.
ME910G1 HW Design Guide NCC Regulatory Notices According to NCC Taiwan requirements, the module and the packaging shall be identified as described in the following lines. Shall be added also the specified safety warning statement. Brand name: Telit Model name: ME910G1-WW Equipment name: WWAN module NCC logo: NCC ID: CCAF20NB0050T0 NCC safety warning statement: “減少電磁波影響，請妥適使用” NCC Note: 注意：行動電話業務(2G)於 106 年 6 月停止提供服務後，本設備 2G 功能在國內將無法使 用。 1VV0301593 Rev.
ME910G1 HW Design Guide 13. PRODUCT AND SAFETY INFORMATION SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE Copyrights and Other Notices Although reasonable efforts have been made to ensure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from the use of the information contained herein. The information in this document has been carefully checked and is believed to be reliable.
ME910G1 HW Design Guide including – but not limited to - the exclusive right to copy or reproduce in any form the copyrighted products. Accordingly, any copyrighted computer programs contained in Telit’s products described in this instruction manual shall not be copied (reverse engineered) or reproduced in any manner without the express written permission of the copyright owner, being Telit or the 3rd Party software supplier.
ME910G1 HW Design Guide Trademarks TELIT and the Stylized T-Logo are registered in the Trademark Office. All other product or service names are property of their respective owners. 3rd Party Rights The software may include 3rd Party’s software Rights. In this case the user agrees to comply with all terms and conditions imposed in respect of such separate software rights.
ME910G1 HW Design Guide Safety Recommendations Make sure the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and has to be avoided in areas where: • • it can interfere with other electronic devices, particularly in environments such as hospitals, airports, aircrafts, etc. there is a risk of explosion such as gasoline stations, oil refineries, etc.
ME910G1 HW Design Guide 14.
ME910G1 HW Design Guide 15. DOCUMENT HISTORY Revision 7 Date 2021-02-02 Changes Reviewed template design and styles Section 2.4, update Chapter 4, update Sections 6.1, 6.2, 6.3, removed (redundant) Section 7.2, removed Section 8.4, measurements update Section 2.2, 2.5, 12.3, adding B86 update 6 2020-09-14 Section 2.5, TX Power update Section 2.
ME910G1 HW Design Guide 1VV0301593 Rev.
