User Guide

ME910G1 Preliminary HW Design Guide
1VV0301593 Rev.2 Page 8 of 95 2020-01-13
6. RF SECTION .............................................................................. 60
Bands Variants ........................................................................... 60
TX Output power ......................................................................... 60
RX Sensitivity ............................................................................. 60
Antenna requirements................................................................. 60
6.4.1. PCB Design guidelines ............................................................... 60
6.4.2. PCB Guidelines in case of FCC Certification .............................. 62
6.4.2.1. Transmission line design ............................................................ 62
6.4.2.2. Transmission Line Measurements .............................................. 63
6.4.2.3. Antenna Installation Guidelines ................................................... 65
7. AUDIO SECTION ....................................................................... 66
Electrical Characteristics ............................................................. 66
Codec examples ......................................................................... 66
8. GNSS SECTION ......................................................................... 67
GNSS Signals Pin-out................................................................. 67
RF Front End Design .................................................................. 67
8.2.1. Guidelines of PCB line for GNSS Antenna .................................. 67
GNSS Antenna Requirements .................................................... 68
8.3.1. GNSS Antenna specification ....................................................... 68
8.3.2. GNSS Antenna – Installation Guidelines ..................................... 68
8.3.3. Powering the External LNA (active antenna) ............................... 68
GNSS Characteristics ................................................................. 69
9. MECHANICAL DESIGN ............................................................. 70
Drawing ...................................................................................... 70
10. APPLICATION PCB DESIGN .................................................... 71
Recommended footprint for the application ................................. 71
PCB pad design .......................................................................... 73
Recommendations for PCB pad dimensions ............................... 74
Thermal performance.................................................................. 75
Stencil ......................................................................................... 75
Solder paste ............................................................................... 76
Solder Reflow ............................................................................. 76
Inspection ................................................................................... 78
11. PACKAGING .............................................................................. 79
Tray ............................................................................................ 79
Reel ............................................................................................ 80