User Guide

ME910G1 Preliminary HW Design Guide
1VV0301593 Rev.2 Page 77 of 95 2020-01-13
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp)
245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate
6°C/second max.
Time 25°C to Peak Temperature
8 minutes max.
NOTE:
All temperatures refer to topside of the package, measured on the
package body surface
WARNING:
THE ME910G1 MODULE WITHSTANDS ONE REFLOW PROCESS
ONLY.
WARNING:
The above solder reflow profile represents the typical SAC reflow limits
and does not guarantee adequate adherence of the module to the
customer application throughout the temperature range. Customer
must optimize the reflow profile depending on the overall system taking
into account such factors as thermal mass and warpage.