User Guide

ME310G1 Hardware Design Guide
1VV0301588 Rev. 11 Page 67 of 91 2021-03-16
Profile Feature
Pb-Free Assembly
Average ramp-up rate (T
L
to T
P
)
3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate
3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp)
245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate
6°C/second max.
Time 25°C to Peak Temperature
8 minutes max.
Table 38 Profile feature recommendations
Note: All temperatures refer to topside of the package, measured on
the package body surface
Warning: THE ME310G1 MODULES WITHSTANDS ONE REFLOW
PROCESS ONLY.
Warning: The aforementioned solder reflow profile represents the
typical SAC reflow limits and does not guarantee the adequate
adherence of the module to the customer application throughout the
temperature range. The customer must optimize the reflow profile
depending on the overall system, taking into account factors such as
thermal mass and warpage.