User Guide

ME310G1 Hardware Design Guide
1VV0301588 Rev. 11 Page 66 of 91 2021-03-16
Stencil
The layout of the stencil apertures can be the same as the recommended footprint (1:1),
we suggest a thickness of stencil foil ≥ 120 µm.
Solder paste
Item
Lead Free
Solder Paste
Sn/Ag/Cu
Table 37: Solder paste
We recommend using only “no clean” solder paste to avoid the cleaning of the modules
after assembly.
Solder Reflow
Recommended solder reflow profile:
Figure 20: Recommended Solder reflow profile
Warning: The aforementioned solder reflow profile represents the
typical SAC reflow limits and does not guarantee the adequate
adherence of the module to the customer application throughout the
temperature range. The customer must optimize the reflow profile
based on the overall system taking into account factors such as
thermal mass and warpage.