User Guide

ME310G1 Hardware Design Guide
1VV0301588 Rev. 11 Page 32 of 91 2021-03-16
Thermal Design Guidelines
Worst case as reference values for thermal design of ME310G1 are:
• Average current consumption: 700 mA (LTE CAT M1 and NB1 modes)
• Average current consumption: 700 mA (GPRS and EDGE modes)
• Supply voltage: 4.50V
Note: Make PCB design in order to have the best connection of GND
pads to large surfaces of copper.
Note: The ME310G1 includes a function to prevent overheating.
Power Supply PCB layout Guidelines
As seen in the guidelines for electrical design, the power supply shall have a low ESR
capacitor on the output to cut the current peaks on the input to protect the supply from
spikes. The placement of this component is crucial for the correct working of the
circuitry. A misplaced component can be useless or can even decrease the power supply
performance.
• The Bypass low ESR capacitor must be placed close to the Telit ME310G1 power
input pads or, if the power supply is a switching type, it can be placed close to the
inductor to cut the ripple, provided the PCB trace from the capacitor to the
ME310G1 is wide enough to ensure a dropless connection even during an 2A
current peak.
• The protection diode must be placed close to the input connector where the power
source is drained.
• The PCB’s traces to the ME310G1 and the Bypass capacitor must be wide enough
to ensure that no significant voltage drops occur. This is for the same reason as
previous point. Try to keep this trace as short as possible.
• To reduce the EMI due to switching, it is important to keep the mesh involved very
small; therefore the input capacitor, the output diode (if not incorporated in the IC)
and the regulator shall form a very small loop.This is done in order to reduce the
radiated field (noise) to the switching frequency (100-500 kHz usually).