ME310G1 HW Design Guide 1VV0301588 Rev.
ME310G1 Hardware Design Guide APPLICABILITY TABLE PRODUCTS ME310G1-W1 ME310G1-WW ME310G1-WWV ME310G1-W2 1VV0301588 Rev.
ME310G1 Hardware Design Guide CONTENTS APPLICABILITY TABLE............................................................................. 2 CONTENTS ............................................................................................... 3 INTRODUCTION ...................................................................... 8 Scope........................................................................................ 8 Audience ...........................................................................
ME310G1 Hardware Design Guide LGA Pads Layout .................................................................... 23 POWER SUPPLY .................................................................... 24 Power Supply Requirements ................................................. 24 Power Consumption .............................................................. 25 Idle mode ............................................................................... 25 ME310G1-W1 Connected Mode ..........................
ME310G1 Hardware Design Guide Serial Ports ............................................................................ 42 5.7.3.1. Asynchronous Serial Port (USIF0) ......................................... 42 5.7.3.2. Asynchronous Serial Port (USIF1) ......................................... 44 5.7.3.3. Auxiliary Serial Port ............................................................... 44 General purpose I/O .............................................................. 45 Using a GPIO as INPUT ...
ME310G1 Hardware Design Guide MECHANICAL DESIGN .......................................................... 57 Drawing .................................................................................. 57 ME310G1-W1 ......................................................................... 57 ME310G1-WW, ME310G1-WWV and ME310G1-W2 ............... 58 APPLICATION PCB DESIGN .................................................. 59 Footprint ..........................................................................
ME310G1 Hardware Design Guide ISED Certificate / ISDE certificates ....................................... 75 Applicable FCC and ISED rules / Liste des règles FCC et ISDE applicables .................................................................... 76 FCC and ISED Regulatory notices / Avis réglementaires de FCC et ISDE ............................................................................ 76 FCC/ISED Antennas / FCC/ISDE Antennes ........................... 77 FCC label and compliance information ..
ME310G1 Hardware Design Guide INTRODUCTION Scope This document introduces the ME310G1 module and presents possible and recommended hardware solutions for the development of a product based on this module. All the features and the solutions described in this document are applicable to all the variants listed in the applicability table. This document cannot include every hardware solution or every product that can be designed.
ME310G1 Hardware Design Guide Symbol Conventions Danger: This information MUST be followed or catastrophic equipment failure or personal injury may occur. Warning: Alerts the user on important steps about the module integration. Note/Tip: Provides advice and suggestions that may be useful when integrating the module. Electro-static Discharge: Notifies the user to take proper grounding precautions before handling the product.
ME310G1 Hardware Design Guide GENERAL PRODUCT DESCRIPTION Overview The ME310G1 module is a CATM / NBIoT communication product that allows integrators to plan availability for even the longest lifecycle applications, highly recommended for new designs specified for worldwide coverage.
ME310G1 Hardware Design Guide Note: “B86” is not a 3GPP band, it means the following: UL range: 787-788 MHz, DL range: 757-758 MHz that is available only in module where AT#BNDOPTIONS command contains the string B86. i.e.
ME310G1 Hardware Design Guide TX Output Power ME310G1-W1 Band Mode Class RF power (dBm) Nominal* B1, B2, B3, B4, B5, B8, B12, B13, B14, B18, B19, B20, B25, B26, B27, B28, B66, B85, B86 (LTE) CAT-M1 5 21 B1, B2, B3, B4, B5, B8, B12, B13, B18, B19, B20, B25, B26, B28, B66, B71, B85 (LTE) CAT-NB1 5 21 Table 4: Transmission Output Power ME310G1-WW and ME310G1-WWV Class RF power (dBm) Nominal* GPRS 4 32.5 EGPRS E2 27 GPRS 1 29.
ME310G1 Hardware Design Guide * Max output power tolerance range according to 3GPP TS 36.521-1 and 3GPP TS 51.010-1 or better RX Sensitivity ME310G1-W1 REFsens (dBm) Typical REFsens (dBm)* 3GPP Limit CATM1 / Band1 -107.1 -102.7 CAT M1 / Band2 -107.5 -100.3 CAT M1 / Band3 -106.4 -99.3 CAT M1 / Band4 -107.3 -102.3 CAT M1 / Band5 -106.0 -100.8 CAT M1 / Band8 -107.3 -99.8 CAT M1 / Band12 -103.2 -99.3 CAT M1 / Band13 -104.3 -99.3 CAT M1 / Band18 -107.2 -102.3 CAT M1 / Band19 -106.
ME310G1 Hardware Design Guide REFsens (dBm) Typical REFsens (dBm)* 3GPP Limit CAT NB2 / Band13 -115.8 -108.2 CAT NB2 / Band18 -115.1 -108.2 CAT NB2 / Band19 -115.4 -108.2 CAT NB2 / Band20 -114.0 -108.2 CAT NB2 / Band25 -115.7 - CAT NB2 / Band26 -115.4 -108.2 CAT NB2 / Band28 -115.7 -108.2 CAT NB2 / Band66 -115.3 -108.2 CAT NB2 / Band71 -111.3 - CAT NB2 / Band85 -115.7 - Band Table 7: RX Sensitivity ME310G1-W1 * 3GPP TS 36.
ME310G1 Hardware Design Guide REFsens (dBm) Typical REFsens (dBm)* 3GPP Limit CAT M1 / Band28 -106.4 -100.8 CAT M1 / Band66 -105.8 - CAT M1 / Band85 -104.0 - CAT NB2 / Band1 -115.7 -108.2 CAT NB2 / Band2 -115.9 -108.2 CAT NB2 / Band3 -115.5 -108.2 CAT NB2 / Band4 -115.1 - CAT NB2 / Band5 -115.8 -108.2 CAT NB2 / Band8 -115.3 -108.2 CAT NB2 / Band12 -115.5 -108.2 CAT NB2 / Band13 -115.5 -108.2 CAT NB2 / Band18 -115.8 -108.2 CAT NB2 / Band19 -115.6 -108.
ME310G1 Hardware Design Guide REFsens (dBm) Typical REFsens (dBm)* 3GPP Limit CAT M1 / Band28 -107.4 -100.8 CAT M1 / Band31 -105.2 -96.6 CAT M1 / Band72 -105.4 -96.6 Band Table 9: RX Sensitivity ME310G1-W2 1VV0301588 Rev. 11 * 3GPP TS 36.
ME310G1 Hardware Design Guide Mechanical Specifications Dimensions The overall dimensions of ME310G1-W1 are: • Length: 14.3 mm • Width: 13.1 mm • Thickness: 2.6 mm The overall dimensions of ME310G1-WW, ME310G1-WWV and ME310G1-W2 are: • Length: 18.0 mm • Width: 15.0 mm • Thickness: 2.6 mm Weight The nominal weight of the ME310G1-W1 is 1gr. The nominal weight of the ME310G1-WW, ME310G1-WWV and ME310G1-W2 is 1.5 gr.
ME310G1 Hardware Design Guide PINS ALLOCATION Pin-out Pin Signal I/O Function Type Comment USB HS 2.0 Communication Port U19 USB_D+ I/O USB differential Data (+) V18 USB_D- I/O USB differential Data (-) T18 USB_VBUS AI USB Power Sense Asynchronous Serial Port (USIF0) – Prog. / Data + HW Flow Control Y16 TXD0 I Serial data input (TXD) from DTE CMOS 1.8V AA15 RXD0 O Serial data output (RXD) to DTE CMOS 1.8V Y18 RTS0 I Input for Request to send signal (RTS) from DTE CMOS 1.
ME310G1 Hardware Design Guide Pin Signal I/O Function Type Comment L1 SIM_CLK O External SIM signal – Clock CMOS 1.8V M2 SIM_RST O External SIM signal – Reset CMOS 1.8V N1 SIM_DAT I/O External SIM signal – Data I/O CMOS 1.8V P2 SIM_VCC - Power supply for the SIM 1.8V Only 1.8V simcard are supported - SIMIN I Presence input CMOS 1.8V See par.5.8 SIM SPI AA5 SPI_MOSI I/O SPI MOSI CMOS 1.8V Y8 SPI_MISO I/O SPI MISO CMOS 1.8V AA7 SPI_CLK I/O SPI Clock CMOS 1.
ME310G1 Hardware Design Guide Pin R16 Signal DAC I/O Function Type O Digital To Analog converter Output D/A I/O Main Antenna (50 ohm) RF Comment PWM signal RF Section A5 CELL_MAIN ANTENNA E19 GNSS ANTENNA I GNSS Antenna RF H18 GNSS_LNA_EN O GNSS external LNA enable CMOS 1.8V G16 GNSS_PPS O 1 Pulse per Second CMOS 1.8V O Status LED CMOS 1.8V CMOS 1.8V CMOS 1.
ME310G1 Hardware Design Guide Pin Signal I/O Function Type A3 GND - RF Ground Power A7 GND - RF Ground Power A9 GND - RF Ground Power A13 GND - RF Ground Power A17 GND - RF Ground Power B4 GND - RF Ground Power B6 GND - RF Ground Power B10 GND - RF Ground Power B12 GND - RF Ground Power B14 GND - RF Ground Power B16 GND - RF Ground Power C19 GND - RF Ground Power D18 GND - RF Ground Power F8 GND - Thermal Ground Power F12 GND - T
ME310G1 Hardware Design Guide Pin Signal I/O Function Type Comment RESERVED G1 RESERVED - RESERVED H2 RESERVED - RESERVED J1 RESERVED - RESERVED K2 RESERVED - RESERVED J4 RESERVED - RESERVED G4 RESERVED - RESERVED L19 RESERVED - RESERVED A11 RESERVED - RESERVED R4 RESERVED - RESERVED L4 RESERVED - RESERVED V7 RESERVED - RESERVED V9 RESERVED - RESERVED L16 RESERVED - RESERVED P18 RESERVED - RESERVED J16 RESERVED - RESERVED R19 RESERVED - R
ME310G1 Hardware Design Guide LGA Pads Layout TOP VIEW 1 2 A S_LED 12 RES 13 14 GND GND GND 15 16 RES GND 17 18 19 GND GND A ADC IO4 IO5 IO6 B GND GND GND GND GND GNSS_ LNA_E N GND RES RES RES GND RES GND SIM_D AT SIM_V CC GND PWRM ON GND GND RES RES GND RES USB_V BUS GND GND RES RES IO1 IO2 T USB_D- VBATT _PA V GND GND AA 2 SPI_C S GND SPI_M OSI VBATT 1 R USB_D U + GND Y N P DAC ROM BOOT L M ON_OF F# CTANK J K RES SIM_R ST G
ME310G1 Hardware Design Guide POWER SUPPLY The power supply circuitry and the board layout are a very important part in the full product design and they strongly reflect on the overall performance of the product so the requirements and the guidelines that will follow should be read carefully for a proper design. Power Supply Requirements The external power supply must be connected to VBATT & VBATT_PA signals and must fulfil the following requirements: Power Supply Value Nominal Supply Voltage 3.
ME310G1 Hardware Design Guide Note: The application’s power supply section must be designed with care to avoid an excessive voltage drop during transmission peak current absorptions. If the voltage drops beyond the limits of the Extended Operating Voltage range, an unintentional module power off can occur. Note: When turning on the modem, the voltage must be at least VBATTmin.
ME310G1 Hardware Design Guide Measure* (Typical) Mode GPS Mode Description (mA) Acquisition Active State (GNSS ON, CFUN=4) 69.3 GPS+GLO, DPO on DWELL=280ms 22 Navigation Acquisition Active State (GNSS ON, CFUN=5 eDRX) 55.9 GPS+GLO, DPO off 68.5 GPS+GLO, DPO off 15.
ME310G1 Hardware Design Guide ME310G1-WW and ME310G1-WWV Connected Mode Measure (Typical) Connected mode CATM Mode Description Average (mA) Peak (mA) 380 1100 1 RB, RMC, TBS=5, QPSK, 23dBm, Band 85, 28, 12 320 900 1 RB, RMC, TBS=5, QPSK,23dBm, Band 13, 26, 5, 18, 19, 20, 8 305 800 1 RB, RMC, TBS=5, QPSK, 23dBm, Band 3, 2, 25, 4, 1, 66 240 335 3.75KHz subcarrier spacing, 1 SC, RU 32ms, TBS=0, BPSK, 20dBm, Band 71 600 1000 3.
ME310G1 Hardware Design Guide ME310G1-W2 Connected Mode Measure (Typical) Mode Connected mode Mode Description Average (mA) Peak (mA) 180 400 1 RB, RMC, TBS=5, QPSK, 21dBm, B1, B3, B8, B20, B28 300 680 1 RB, RMC, TBS=5, QPSK 26dBm, B31, B72 245 340 3.75KHz subcarrier spacing, 1 SC, RU 32ms, TBS=0, BPSK, 21dBm, B1, B3, B8, B20, B28 430 750 3.
ME310G1 Hardware Design Guide used. A switching power supply will not be suited due to the low drop out requirements. • When using a linear regulator, a proper heat sink shall be provided in order to dissipate the power generated. • A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks close to the Module, a 100μF capacitor is usually suitable. • Make sure the low ESR capacitor on the power supply output is rated at least 10V.
ME310G1 Hardware Design Guide • In any case the frequency and Switching design selection is related to the application to be developed since the switching frequency could also generate EMC interferences. • For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind when choosing components: all components in the power supply must withstand this voltage.
ME310G1 Hardware Design Guide • A protection diode should be inserted close to the power input, in order to save the ME310G1 from power polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity inversions when connecting the battery. • The battery must be rated to supply current peaks up to 2A. Note: DO NOT USE any type of Ni-Cd, Ni-MH, and Pb battery directly connected to ME310G1. Their use can lead to overvoltage on the ME310G1 and damage it.
ME310G1 Hardware Design Guide Thermal Design Guidelines Worst case as reference values for thermal design of ME310G1 are: • Average current consumption: 700 mA (LTE CAT M1 and NB1 modes) • Average current consumption: 700 mA (GPRS and EDGE modes) • Supply voltage: 4.50V Note: Make PCB design in order to have the best connection of GND pads to large surfaces of copper. Note: The ME310G1 includes a function to prevent overheating.
ME310G1 Hardware Design Guide • A dedicated ground for the Switching regulator separated by the common ground plane is suggested. • The placement of the power supply on the board should be done in such a way to guarantee that the high current return paths in the ground plane are not overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier. • The power supply input cables should be kept separate from noise sensitive lines such as microphone/earphone cables.
ME310G1 Hardware Design Guide Item Min Typical Max Output voltage 1.35V 1.8V 1.8V Output current - 1mA 3mA Table 17: Operating range characteristics of PWRMON signal Note: PWRMON during PSM period is LOW ( PSM has to be previously enabled by AT+CPSMS command) Note: The Output Current MUST never be exceeded; care must be taken when designing the application section to avoid an excessive current consumption. If the Current exceeds the limits it may cause a module shutdown.
ME310G1 Hardware Design Guide DIGITAL SECTION ME310G1 has four main operation states: • • • • OFF state: Vbatt is applied and only RTC is running. The Baseband is switched OFF and the only possible change is the ON state. ON state: the baseband is fully switched on and ME310G1 is ready to accept AT commands. ME310G1 can be idle or connected. Sleep mode state: the main baseband processor is intermittently switched ON and AT commands can be processed with some latency.
ME310G1 Hardware Design Guide Power On The following flow chart shows the proper “Modem Turn ON” procedure. “Modem ON Proc” START N VBATT>VBATTmin? Y Y PWRMON=ON ? N ON_OFF* = LOW Delay = 5 sec ON_OFF*= HIGH N PWRMON=ON ? Y Delay = 1 sec GO TO “Start AT Commands”” “Modem ON Proc” END Figure 5: Modem On Proc flow chart 1VV0301588 Rev.
ME310G1 Hardware Design Guide In some use cases ON_OFF* can be tied fix LOW taking in account two limitations: 1. PSM wake-up asynchronous capability will be lost. 2. To perform an unconditional shutdown it is necessary to send AT#SYSHALT command and then cut Vbatt. Power Off The proper procedure to power-off the module is to use the AT#SHDN command. An alternative procedure is to use ON_OFF* pin as described in the following procedure: “Modem OFF Proc.
ME310G1 Hardware Design Guide Unconditional shutdown The following flow chart shows the proper procedure for unconditional shutdown of ME310G1 except in PSM mode. When the procedure is completed the ME310G1 is reset and it stops any operation. After the release of the line, the ME310G1 is unconditionally shut down, without performing any detach operation from the network in which it is registered.
ME310G1 Hardware Design Guide Warning: Unconditional Hardware SHUTDOWN by toggling VBATT Power, must not be used during the normal shutdown operation of the device since it does not detach the device from the network and can damage the memory content. It shall be kept as an emergency exit procedure. INCORRECT SHUTDOWN Procedure can void the warranty. Wake up from deep sleep mode ME310G1 supports the Power Saving Mode (PSM) functionality defined in 3GPP Release 12.
ME310G1 Hardware Design Guide Fast shut down by hardware The Fast Power Down can be triggered by configuration of any GPIO. HI level to LOW level transition of GPIO triggers fast power down procedure. Example circuit: Note: Consider voltage drop under max current conditions when defining the voltage detector thereshold in order to avoid unwanted shutdown. Fast shut down by software The Fast Shut Down can be triggered by AT command. 1VV0301588 Rev.
ME310G1 Hardware Design Guide Communication ports USB 2.0 HS The ME310G1 includes one integrated universal serial bus (USB 2.0 HS) transceiver. The following table lists the available signals: PAD Signal I/O Function NOTE U19 USB_D+ I/O USB differential Data (+) V18 USB_D- I/O USB differential Data (-) T18 VUSB AI Power sense for the internal USB transceiver. Table 20: USB 2.
ME310G1 Hardware Design Guide PAD Y6 Signal I/O SPI_CS I/O Function SPI Chip Select Type NOTE CMOS 1.8V Table 23: Available signals Note: The SPI interface is supported through the Telit AppZone APIs.
ME310G1 Hardware Design Guide RS232 Pin 4 5 8 7 9 Signal Pad Name Usage DTR (*) Data Terminal Ready Input to the ME310G1 that controls the DTE READY condition GND A3, A7, A9, A13, A17, B4, B6, B10, B12, B14, B16, C19, D18, F8, F12, F18, G19, H6, H14, J19, K18, M18, N19, P6, P14, T8, T12, U1, V2, W19, Y2, Y4 Ground Ground Clear to Send Output from the ME310G1 that controls the Hardware flow control Request to Send Input to the ME310G1 that controls the Hardware flow control Pull-up defau
ME310G1 Hardware Design Guide 5.7.3.2. Asynchronous Serial Port (USIF1) The serial port 1 on the ME310G1 is a +1.8V UART with 5 RS232 signals. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels. Warning: C104/RXD1 cannot have any PU or HIGH state during BOOTING UP phase.
ME310G1 Hardware Design Guide General purpose I/O The ME310G1 module is provided by a set of Configurable Digital Input / Output pins (CMOS 1.8V). Input pads can only be read; they report the digital value (high or low) present on the pad at the read time of. The Output pads can only be written or queried and set the value of the pad output. An alternate function pad is internally controlled by the ME310G1 firmware and acts depending on the implemented function.
ME310G1 Hardware Design Guide External SIM Holder Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a). Note: There is no dedicated signal (SIMIN) for “Presence SIM” in the ME310G1 pinout. This feature can performed by connecting GPIO_01 (Pad V11) or of GPIO_02 (Pad V13) or of GPIO_03 (Pad D7) or of GPIO_04 (Pad D9) to the switch embedded in the sim-holder. SIM detection can be configured by a specific AT Command.
ME310G1 Hardware Design Guide Item Min Typical Max Unit Input Voltage range 0 - 1.8 Volt AD conversion - - 10 bits Table 28 ADC Characteristics Using ADC Converter Available in a next document revision. DAC Converter The ME310G1 provides a Digital to Analog Converter. The signal (named DAC) is available on pin R16 of the ME310G1. Enabling DAC Available in a next document revision.
ME310G1 Hardware Design Guide RF SECTION Antenna requirements The antenna connection and board layout design are the most important aspect in the full product design as they strongly affect the general performance of the product, so read carefully and follow the requirements and the guidelines for a proper design.
ME310G1 Hardware Design Guide PCB Design guidelines When using the ME310G1, since there's no antenna connector on the module, the antenna must be connected to the ME310G1 antenna pad by means of a transmission line implemented on the PCB. This transmission line shall fulfil the following requirements: Item Value Characteristic Impedance 50 ohm (+-10%) Max Attenuation 0.
ME310G1 Hardware Design Guide • if EM noisy devices (such as fast switching ICs, LCD and so on) are present on the PCB hosting the ME310G1, take care of the shielding of the antenna line by burying it in an inner layer of PCB and surrounding it with the Ground planes, or shield it with a metal frame cover; • if the noisy EM devices are not present around the line, the use of geometries such as Microstrip or Grounded Coplanar Waveguide is preferable, since they typically ensure less attenuation than a St
ME310G1 Hardware Design Guide AUDIO SECTION The Telit digital audio interface (DVI) of the ME310G1 Module is based on the I2S serial bus interface standard. The audio port can be connected to the end device through the digital interface, or through one of the several compliant codecs (in case an analog audio is needed).
ME310G1 Hardware Design Guide GNSS SECTION The ME310G1 module includes a state-of-the-art receiver capable of simultaneously searching and tracking satellite signals from multiple satellite constellations. This multiGNSS receiver uses the entire spectrum of GNSS systems available: GPS, GLONASS, BeiDou, Galileo, and QZSS. GNSS Signals Pin-out Pin Signal I/O Function Type E19 ANT_GNSS I GNSS Antenna (50 ohm) H18 GNSS_LNA_EN O GNSS External LNA Enable CMOS 1.
ME310G1 Hardware Design Guide • Place EM noisy devices as far as possible from antenna line. • Keep the antenna line away from power supply lines. • Keep the antenna line away from GSM RF lines. • If there are noisy EM devices around the PCB hosting the module, such as fast switching ICs, take care of the shielding of the antenna line by burying it inside the layers of the PCB and surrounding it with the Ground planes, or shielding it with a metal frame cover.
ME310G1 Hardware Design Guide GNSS Antenna Requirements GNSS active antenna must be used or integrated in the application. GNSS Antenna specification Item Value Frequency range 1559.0 ~ 1610.0 MHz Gain 15 ~ 30dB Impedance 50 ohm Noise Figure of LNA < 1.5 (recommended) DC supply voltage DC 1.8 ~ 3.
ME310G1 Hardware Design Guide The electrical characteristics of the GPS_LNA_EN signal are: Level Min Max Output High Level 1.6V 1.9V Output Low Level 0V 0.3V Table 34: GPS_LNA_EN signal characteristics Example of external antenna bias circuitry: Figure 10: Antenna bias circuitry example Pay attention to the maximum bias current in case of unwanted short circuit on the antenna cable since the decoupling inductor can be damaged. 1VV0301588 Rev.
ME310G1 Hardware Design Guide GNSS Characteristics The table below specifies the GNSS characteristics and expected performance. Typical Measurement Parameters Sensitivity TTFF Notes Tracking Sensitivity -159 dBm Navigation -155 dBm Cold Start -144 dBm Hot N/A It will be available in next revision Warm <30s GNSS Simulator test @-130dBm Cold <30s GNSS Simulator test @-130dBm Min Navigation update rate 1Hz CEP <2m Table 35: GNSS Characteristics 1VV0301588 Rev.
ME310G1 Hardware Design Guide MECHANICAL DESIGN Drawing ME310G1-W1 Figure 11: Mechanical Drawing ME310G1-W1 Note: Dimensions in mm. General Tolerance ±0.1, Angular Tolerance ±1°, The tolerance is not cumulative. 1VV0301588 Rev.
ME310G1 Hardware Design Guide ME310G1-WW, ME310G1-WWV and ME310G1-W2 Figure 12: Mechanical Drawing ME310G1-WW, ME310G1-WWV and ME310G1-W2 1VV0301588 Rev.
ME310G1 Hardware Design Guide APPLICATION PCB DESIGN The ME310G1 modules have been designed in order to be compliant with a standard leadfree SMT process. Footprint ME310G1-W1 COPPER PATTERN (top view) Figure 13: Copper Pattern (top view) 1VV0301588 Rev.
ME310G1 Hardware Design Guide SOLDER RESIST PATTERN (top view) Figure 14: Solder resist pattern (top view) 1VV0301588 Rev.
ME310G1 Hardware Design Guide ME310G1-WW, ME310G1-WWV and ME310G1-W2 COPPER PATTERN (top view) Figure 15: Example Figure 1VV0301588 Rev.
ME310G1 Hardware Design Guide SOLDER RESIST PATTERN (top view) Figure 16: Example Figure 1VV0301588 Rev.
ME310G1 Hardware Design Guide Recommendations for ME310G1-W1 In order to easily rework the ME310G1-W1, it is recommended to consider on the application a 2 mm placement inhibit area around the module. It is also suggested, as a common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.
ME310G1 Hardware Design Guide Recommendations ME310G1-W2 for ME310G1-WW, ME310G1-WWV and In order to easily rework the ME310G1-WW, ME310G1-WWV and ME310G1-W2 it is recommended to consider the application placement inhibit area around the module, as specified in the below figure. It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the application in direct contact with the module.
ME310G1 Hardware Design Guide PCB pad design Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB. Copper Solder Mask PCB SMD NSMD (Soler Mask Defined) (Non Solder Mask Defined) Figure 19: PCB solder pad recommendations The recommendation for the PCB pads dimensions are 1:1 with module pads. It is not recommended to place via or micro-via not covered by solder resist in an area of 0.
ME310G1 Hardware Design Guide Stencil The layout of the stencil apertures can be the same as the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120 µm. Solder paste Item Lead Free Solder Paste Sn/Ag/Cu Table 37: Solder paste We recommend using only “no clean” solder paste to avoid the cleaning of the modules after assembly.
ME310G1 Hardware Design Guide Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max Preheat – Temperature Min (Tsmin) – Temperature Max (Tsmax) – Time (min to max) (ts) 150°C 200°C 60-180 seconds Tsmax to TL – Ramp-up Rate 3°C/second max Time maintained above: – Temperature (TL) – Time (tL) 217°C 60-150 seconds Peak Temperature (Tp) 245 +0/-5°C Time within 5°C of actual Peak Temperature (tp) 10-30 seconds Ramp-down Rate 6°C/second max.
ME310G1 Hardware Design Guide PACKAGING Tray ME310G1-W1 Figure 21: ME310G1-W1 tray packaging 1VV0301588 Rev.
ME310G1 Hardware Design Guide Figure 22: ME310G1-W1 tray 1VV0301588 Rev.
ME310G1 Hardware Design Guide ME310G1-WW Figure 23: ME310G1-WW tray packaging 1VV0301588 Rev.
ME310G1 Hardware Design Guide Figure 24: ME310G1-WW tray 1VV0301588 Rev.
ME310G1 Hardware Design Guide Reel ME310G1-W1 1VV0301588 Rev.
ME310G1 Hardware Design Guide ME310G1-WW and ME310G1-W2 1VV0301588 Rev.
ME310G1 Hardware Design Guide CONFORMITY ASSESSMENT ISSUES Approvals summary Type Approval ME310G1-W1 ME310G1-WW ME310G1-WWV ME310G1-W2 EU RED Yes Yes Yes Yes US FCC Yes Yes Yes - CA ISED Yes Yes Yes - BRAZIL ANATEL - Yes - - JAPAN JRF & JTBL - Yes - - CHINA CCC - Yes - - In planning Yes - - - Yes - - Singapore INDA NCC Taiwan Table 39: Type approvals summary RED approval RED Declaration of Conformity Hereby, Telit Communications S.p.
ME310G1 Hardware Design Guide Table 40: RED Antenna Type Max Gain for RED (dBi) Band ME310G1-W1 ME310G1-WW ME310G1-WWV ME310G1-W2 GSM 900 --- --- 8.48 --- DCS 1800 --- --- 14.36 --- GPRS/EGPRS 900 --- 5.97 5.97 GPRS/EGPRS 1800 --- 10.34 9.34 FDD 1 14.84 11.84 11.84 14.3 FDD 3 14.33 11.33 11.33 13.8 FDD 8 11.45 8.45 8.45 10.7 FDD 20 11.20 8.20 8.20 11.2 FDD 28 10.47 7.47 7.47 10.7 FDD 31 --- --- --- 2.5 FDD 72 --- --- --- 2.
ME310G1 Hardware Design Guide Applicable FCC and ISED rules / Liste des règles FCC et ISDE applicables Model Modèle Applicable FCC Rules ME310G1-W1 ME310G1-WW 47 CFR Part 2, 22, 24, 27, 90 ME310G1-WWV Applicable ISED Rules Règles ISDE applicables RSS: 132 Issue3, 133 Issue 6, 130 Issue 2, 139 Issue 3; RSS-Gen Issue 5 Table 42 Applicable FCC and ISED rules FCC and ISED Regulatory notices / Avis réglementaires de FCC et ISDE Modification statement / Déclaration de modification Telit does not approve
ME310G1 Hardware Design Guide Le présent appareil est conforme à l'exposition aux radiations FCC / ISED définies pour un environnement non contrôlé et répond aux directives d'exposition de la fréquence de la FCC radiofréquence (RF) et RSS‐102 de la fréquence radio (RF) ISED règles d'exposition. L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.
ME310G1 Hardware Design Guide ME310G1-W1 Omnidirectional Antenna Gain 2.14 dBi ME310G1-WW ME310G1-WWV Table 43 FCC Antenna Type Max Gain for FCC (dBi) Band ME310G1-W1 ME310G1-WW ME310G1-WWV GSM 850 --- --- 6.6 GSM 1900 --- --- 2.0 GPRS/EGPRS 850 --- 6.9 6.9 GPRS/EGPRS 1900 --- 2.5 2.5 FDD 2 11.0 8.0 8.0 FDD 4 8.0 5.0 5.0 FDD 5 12.4 9.4 9.4 FDD 12 11.6 8.7 8.7 FDD 13 12.1 9.1 9.1 FDD 25 11.0 8.0 8.0 FDD 26 12.3 9.3 9.3 FDD 66 8.0 5.0 5.0 FDD 71 11.
ME310G1 Hardware Design Guide ME310G1-WW ME310G1-WWV Antenna Gain 2.14 dBi Omnidirectionelle Gain de l’antenne 2.14 dBi Table 45: ISED Antenna Type Gain maximum for ISED (dBi) / Gain maximum pour ISDE (dBi) Bande ME310G1-W1 ME310G1-WW ME310G1-WWV GSM 850 --- --- 6.1 GSM 1900 --- --- 2.0 GPRS/EGPRS 850 --- 3.6 3.6 GPRS/EGPRS 1900 --- 2.5 2.5 FDD 2 11.0 8.0 8.0 FDD 4 8.0 5.0 5.0 FDD 5 9.1 6.1 6.1 FDD 12 8.6 5.6 5.6 FDD 13 8.9 5.9 5.9 FDD 25 11.0 8.0 8.
ME310G1 Hardware Design Guide Table 47: FCC ID ISED label and compliance information/Étiquette et informations de conformité ISDE The host product shall be properly labelled to identify the modules within the host product.
ME310G1 Hardware Design Guide simultaneously transmitting modules or other transmitters in a host), additional testing may be required (collocation, retesting…) If this module is intended for use in a portable device, the user is responsible for separate approval to meet the SAR requirements of FCC Part 2.1093 and IC RSS-102. Le module a été évalué dans des conditions autonomes mobiles.
ME310G1 Hardware Design Guide NCC Regulatory Notices According to NCC Taiwan requirements, the module and the packaging shall be identified as described in the following lines. Shall be added also the specified safety warning statement. Brand name: Telit Model name: ME310G1-WW Equipment name: WWAN module NCC logo: NCC ID: CCAF21Y00040 NCC safety warning statement: “減少電磁波影響，請妥適使用” NCC Note: 注意：行動電話業務(2G)於106年6月停止提供服務後，本設備2G功能在國內將 無法使用。 1VV0301588 Rev.
ME310G1 Hardware Design Guide PRODUCT AND SAFETY INFORMATION Copyrights and Other Notices SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE Although reasonable efforts have been made to ensure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from the use of the information contained herein. The information in this document has been carefully checked and is believed to be reliable.
ME310G1 Hardware Design Guide including – but not limited to - the exclusive right to copy or reproduce in any form the copyrighted products. Accordingly, any copyrighted computer programs contained in Telit’s products described in this instruction manual shall not be copied (reverse engineered) or reproduced in any manner without the express written permission of the copyright owner, being Telit or the 3rd Party software supplier.
ME310G1 Hardware Design Guide Trademarks TELIT and the Stylized T-Logo are registered in the Trademark Office. All other product or service names are property of their respective owners. 3rd Party Rights The software may include 3rd Party’s software Rights. In this case the user agrees to comply with all terms and conditions imposed in respect of such separate software rights.
ME310G1 Hardware Design Guide Safety Recommendations Make sure the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and has to be avoided in areas where: • it can interfere with other electronic devices, particularly in environments such as hospitals, airports, aircrafts, etc. • there is a risk of explosion such as gasoline stations, oil refineries, etc.
ME310G1 Hardware Design Guide GLOSSARY ADC Analog – Digital Converter BPSK Modulation used for in OFDM symbols CLK Clock CMOS Complementary Metal – Oxide Semiconductor CS Chip Select DAC Digital – Analog Converter DTE Data Terminal Equipment DVI Digital Voice Interface EM Electromagnetic EMC Electromagnetic Compatibility EMI Electromagnetic Interference ESR Equivalent Series Resistance FDD Frequency Division Duplexing GPIO General Purpose Input Output HS High Speed HSDPA High
ME310G1 Hardware Design Guide RB Resource Block; the smallest unit of resources that can be allocated to a user RF Radio Frequency RMC Reference Measurement Channel; it refers to a 3GPP standardized setting for the channel. For more details, refer to 3GPP TS 36.
ME310G1 Hardware Design Guide DOCUMENT HISTORY Revision 11 Date 2021-03-16 Changes Section12.5, added NCC Regulatory Notices Section 8.4, measurements update Section 2.2 and 2.5 added B86 Section 12.3 added B86 FCC antenna info 10 2021-01-12 Reviewed template design and styles Section 12.2 updated with ME310G1-W2 information Section 11.2 updated with Reel information Section 7.2 removed Chapter 4 update 8 2020-09-14 Added ME310G1-W2 variant Section 2.5, TX Power update Section 2.
ME310G1 Hardware Design Guide Revision 2 Date 2019-08-13 Changes Added ME310G1-WW Update of Temperature range table N16 pin update (ON_OFF*/WAKE* ) ON/OFF procedure updated 1 2019-06-13 Band list update, pinout update Added SIMIN, USB_VBUS, CTANK, PWRMON, ROM_BOOT pins description Added power on procedure 0 2019-03-11 1VV0301588 Rev.
