User Guide

ME310G1 Hardware User Guide
1VV0301588 Rev. 4 Page 63 of 77 2020-01-21
WARNING:
The above solder reflow profile represents the typical SAC reflow
limits and does not guarantee adequate adherence of the module to
the customer application throughout the temperature range.
Customer must optimize the reflow profile depending on the overall
system taking into account such factors as thermal mass and
warpage..
Profile Feature
Pb-Free Assembly
Average ramp-up rate (T
L
to T
P
)
3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate
3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp)
245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate
6°C/second max.
Time 25°C to Peak Temperature
8 minutes max.