User Guide

ME310G1 Hardware User Guide
1VV0301588 Rev. 4 Page 62 of 77 2020-01-21
Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest
a thickness of stencil foil ≥ 120 µm.
Solder paste
Item
Lead Free
Solder Paste
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.
Solder Reflow
Recommended solder reflow profile: