User Guide

LM960 HW Design Guide
1VV0301485 Rev. 15 Page 37 of 88 2020-08-13
In LTE/WCDMA/HSPA mode, the LM960 emits RF signals continuously during
transmission. Therefore, special attention must be paid on how to dissipate the heat
generated.
While designing the application board, special care must be taken by placing the LM960
module on a large ground area of the application board for effective heat dissipation.
Information – The LM960 must be connected to the ground and metal
chassis of the host board for best RF performance and thermal
dissipation.
The two holes at the top of the module and the main ground
of the host board must be fastened together.
The module shield and the host device main board or metal
chassis should be connected by means of conductive
materials.
4.3.3. Power Supply PCB layout Guidelines
As described in the electrical design guidelines, the power supply must have a low ESR
capacitor on the output to cut current peaks and a protection diode on the input to protect
the supply from spikes and polarity inversion. Placement of these components is crucial
for the correct operation of the circuitry: a misplaced component can be useless or can
even decrease the power supply performances.
The bypass low ESR capacitor must be placed close to the LM960 power input
pins or - if the power supply is of a switching type - it can be placed close to the
inductor to reduce ripple, as long as the PCB trace from the capacitor to LM960 is
wide enough to ensure a drop-less connection even during the 2A current peaks.
The protection diode must be placed close to the input connector where the power
source is drained.
The PCB traces from the input connector to the power regulator IC must be wide
enough to ensure that no voltage drops occur during the 2A current peaks.
The PCB traces to LM960 and the bypass capacitor must be wide enough to
ensure that no significant voltage drops occur when the 2A current peaks are
absorbed. This is needed for the same above-mentioned reasons. These traces
should be kept as short as possible.