LM960 HW Design Guide [01.2017] 1VV0301485 Rev.3 –2018-12-14 Mod.0818 2017-01 Rev.
LM960 HW Design Guide SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE NOTICE While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions.
LM960 HW Design Guide USAGE AND DISCLOSURE RESTRICTIONS I. License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. II. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law.
LM960 HW Design Guide Applicability Table PRODUCTS LM960 1VV0301485 Rev.
LM960 HW Design Guide Contents NOTICE 2 COPYRIGHTS .................................................................................................. 2 COMPUTER SOFTWARE COPYRIGHTS ....................................................... 2 USAGE AND DISCLOSURE RESTRICTIONS ................................................ 3 APPLICABILITY TABLE .................................................................................. 4 CONTENTS ......................................................................
LM960 HW Design Guide 4. POWER SUPPLY ........................................................................ 28 Power Supply Requirements ........................................................ 28 Power Consumption ..................................................................... 28 General Design Rules .................................................................. 29 4.3.1. Electrical Design Guidelines ......................................................... 29 4.3.1.1.
LM960 HW Design Guide 6.5.5.2. Using a GPIO Pin as Output ........................................................ 47 6.5.6. I2C – Inter-integrated circuit ......................................................... 47 Using the Temperature Monitor Function ..................................... 48 7. RF SECTION ................................................................................ 49 Antenna requirements ..................................................................
LM960 HW Design Guide READ CAREFULLY ..................................................................... 67 14. REFERENCE TABLE OF RF BANDS CHARACTERISTICS ..... 68 15. ACRONYMS ................................................................................ 71 16. DOCUMENT HISTORY ................................................................ 73 1VV0301485 Rev.
LM960 HW Design Guide 1. INTRODUCTION Scope This document introduces the Telit LM960 module and presents possible and recommended hardware solutions for developing a product based on the LM960 module. All the features and solutions detailed in this document are applicable to all LM960 variants, where “LM960” refers to the variants listed in the Applicability Table. If a specific feature is applicable to a specific product only, it will be clearly marked.
LM960 HW Design Guide For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit: http://www.telit.com To register for product news and announcements or for product questions contact Telit’s Technical Support Center (TTSC). Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users of our information. 1VV0301485 Rev.
LM960 HW Design Guide Text Conventions Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning – Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction. Tip or Information – Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, i.e. YYYY-MM-DD. 1VV0301485 Rev.
LM960 HW Design Guide Related Documents LM960 SW User Guide, 1VV0301477 LM960 AT Commands Reference Guide, 80568ST10869A Generic EVB HW User Guide, 1VV0301249 LM960 Interface Board HW User Guide, 1VV0301502 SIM Integration Design Guide Application Note Rev10, 80000NT10001A 1VV0301485 Rev.
LM960 HW Design Guide 2. GENERAL PRODUCT DESCRIPTION Overview The aim of this document is to present possible and recommended hardware solutions useful for developing a product with the Telit LM960 Mini PCIe module.
LM960 HW Design Guide Verizon CA_[2A]-[2A], CA_[2A]-[4A], CA_[2A]-5A, CA_[2A]-13A, CA_[2A]-[66A], CA_[4A]-[4A], CA_[4A]-5A, CA_[4A]-13A, CA_5A-[66A], CA_5B, CA_13A-[66A], CA_[66A]-[66A], CA_[66B], CA_[66C], CA_[2A]-48A, CA_13A-48A, CA_48A-[66A] Sprint CA_[25A]-[25A], CA_[25A]-26A, CA_25A-41A, CA_26A-[41A], CA_[41A]-[41A], CA_[41C] Generic CA_1C, CA_[2C], CA_3C, CA_7C, CA_12B, CA_38C, CA_39C, CA_40C, CA_[41C], CA_42C, CA_48C, CA_[66B], CA_[66C], CA_[2A]-[2A], CA_3A-3A, CA_[4A]-[4A], CA_7A-7A, CA_48A-48
LM960 HW Design Guide Generic CA_1A-3A-7A, CA_1A-3A-19A, CA_1A-3A-20A, CA_1A-3A-28A, CA_1A-3A-38A, CA_1A-7A-20A, CA_1A-7A-28A, CA_1A-7C, CA_1A-40C, CA_1A-41C, CA_1A-42C, CA_1A-46C, CA_[2A]-2A-12A, CA_2A-[2A]-12A, CA_[2A]-2A-66A, CA_2A-[2A]-66A, CA_2A-2A-[66A], CA_[2A]-2A-71A, CA_2A-[2A]-71A, CA_[2A]-4A-4A, CA_2A-[4A]-4A, CA_2A-4A-[4A], CA_[2A]-4A-5A, CA_2A-[4A]-5A, CA_[2A]-4A-12A, CA_2A-[4A]-12A, CA_[2A]-4A-29A, CA_2A-[4A]-29A, CA_[2A]-4A-71A, CA_2A-[4A]-71A, CA_2A-7A-12A, CA_[2A]-12A-66A, CA_2A-12A-[66A]
LM960 HW Design Guide Refer to Chapter 14 for details information about frequencies and bands.
LM960 HW Design Guide Function Major software features Features o Accessing the Application Processor’s file system o AT command access o High-speed WWAN access to external host o Diagnostic monitoring and debugging o Communication between Java application environment and an external host CPU o NMEA data to an external host CPU PCIe(Optional) Peripheral Ports – GPIOs Advanced security features o Boot integrity of firmware up to customer applications o Disable/secure re-enable of
LM960 HW Design Guide Block Diagram Below figure shows an overview of the internal architecture of the LM960 module. LM960 Block Diagram It includes the following sub-functions: Application processor, Module subsystem and Location processing with their external interfaces. These three functions are contained in a single SOC. RF front end Rich IO interfaces.
LM960 HW Design Guide RX Sensitivity Below the 3GPP measurement conditions used to define the RX sensitivity: Technology 3GPP Compliance 4G LTE Throughput >95% 10MHz Dual Receiver 3G WCDMA BER <0.1% 12.2 Kbps Dual Receiver Product Band Typical Rx Sensitivity (dBm) * / ** (BW = 10 MHz / B46 BW = 20 MHz) LM960 1VV0301485 Rev. 3 LTE FDD B1 -100.0 dBm LTE FDD B2 -100.0 dBm LTE FDD B3 -100.0 dBm LTE FDD B4 -100.5 dBm LTE FDD B5 -101.0 dBm LTE FDD B7 -100.0 dBm LTE FDD B8 -100.
LM960 HW Design Guide LM960 LTE TDD B41 -99.0 dBm LTE TDD B42 -100.0 dBm LTE TDD B43 -100.0 dBm LTE TDD B46 (DL Only) -95.0 dBm LTE TDD B48 -100.0 dBm LTE FDD B71 -99.5 dBm WCDMA FDD B1 -111.0 dBm WCDMA FDD B2 -110.0 dBm WCDMA FDD B4 -111.0 dBm WCDMA FDD B5 -111.0 dBm WCDMA FDD B8 -110.0 dBm WCDMA FDD B9 -110.0 dBm WCDMA FDD B19 -111.0 dBm * LTE Rx Sensitivity shall be verified by using both (all) antenna ports simultaneously. ** 3.
LM960 HW Design Guide Environmental Requirements 2.9.1. Temperature Range Note Operating Temperature Range –20°C ~ +55°C This range is defined by 3GPP (the global standard for wireless mobile communication). Telit guarantees its modules to comply with all the 3GPP requirements and to have full functionality of the module with in this range. –40°C ~ +85°C Telit guarantees full functionality within this range as well.
LM960 HW Design Guide 3. PINS ALLOCATION Pin-out LM960 Pin-out Pin Signal I/O Function Type Comment USB HS 2.0 Communication Port 38 USB_D+ I/O USB 2.0 Data Plus Analog 36 USB_D- I/O USB 2.0 Data Minus Analog USB SS 3.0 Communication and PCIe Port 25 USB_TX_P O USB 3.0 superspeed/PCIe transmit – plus Analog O USB 3.0 superspeed/PCIe transmit – minus Analog I USB 3.0 superspeed/PCIe receive – plus Analog I USB 3.
LM960 HW Design Guide 22 PCIE_RESET_N I Functional reset to the PCIe bus 1.8V SIM Card Interface 1 8 SIMVCC1 O Supply output for an external UIM1 card 1.8V / 2.85V 10 SIMIO1 I/O Data connection with an external UIM1 card 1.8V / 2.85V 12 SIMCLK1 O Clock output to an external UIM1 card 1.8V / 2.85V 14 SIMRST1 O Reset output to an external UIM1 card 1.8V / 2.85V Power SIM Card Interface 2 16 SIMVCC2 O Supply output for an external UIM2 card 1.8 / 2.
LM960 HW Design Guide GPIO_04 46 I/O General purpose I/O 1.8V Control Signal 1 PCIE_WAKE_N O PCIe wake-up 1.8V 20 W_DISABLE_N I RF disable Open-drain 42 WAN_LED_N O LED control Open-drain Internal VBATT Pull-up Miscellaneous Functions 28 VREG_L6_1P8 O Reference Voltage 1.8V 48 SYSTEM_RESET_N I Reset Input 1.8V Power Digital Audio Interface 45 DVI _CLK O PCM Clock 1.8V 47 DVI _TX O PCM Data Out 1.8V 49 DVI _RX I PCM Data In 1.
LM960 HW Design Guide 41 VBATT I Power supply Power 52 VBATT I Power supply Power 4 GND - Ground Ground 9 GND - Ground Ground 15 GND - Ground Ground 18 GND - Ground Ground 21 GND - Ground Ground 26 GND - Ground Ground 27 GND - Ground Ground 29 GND - Ground Ground 34 GND - Ground Ground 35 GND - Ground Ground 37 GND - Ground Ground 40 GND - Ground Ground 43 GND - Ground Ground 50 GND - Ground Ground GROUND Information – If the
LM960 HW Design Guide Information – Unless otherwise specified, RESERVED pins must be left unconnected (Floating).
LM960 HW Design Guide Pin Layout LM960 Pin Layout Top side - Odd pins PCIE_WAKE_N GPIO_01 GPIO_02 PCIE_CLKREQ_N GND PCIE_REFCLK_M PCIE_REFCLK_P GND SIMCLK2 SIMIO2 GND USB/PCIE_TX_M USB/PCIE_TX_P GND GND USB/PCIE_RX_M USB/PCIE_RX_P GND GND VBATT VBATT GND DVI_CLK DVI_TX DVI_RX DVI_WAO Bottom side - Even pins 1 3 5 7 9 11 13 15 2 4 6 8 10 12 14 16 VBATT 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 GND 54 1VV03
LM960 HW Design Guide 4. POWER SUPPLY The power supply circuitry and board layout are very important parts of the full product design, with critical impact on the overall product performance. Read the following requirements and guidelines carefully to ensure a good and proper design. Power Supply Requirements The LM960 power requirements are as follows: Power Supply Requirements Nominal supply voltage 3.3V Supply voltage range 3.10V – 3.
LM960 HW Design Guide Mode 3DL CA with 4x4 MIMO / 1UL Average [Typ.] 1200mA Mode Description CA_2A-66C, 4x4 MIMO, Full RB, 256QAM DL / 64QAM UL (FDD 1.2Gbps DL / 75Mbps UL) Operative Mode (WCDMA) WCDMA Voice 750 mA WCDMA voice call (Tx = 23 dBm) WCDMA HSPA (22 dBm) 650 mA WCDMA data call (DC-HSDPA up to 42 Mbps, Max Throughput) * Worst/best case current values depend on network configuration - not under module control. ** Loop-back mode in call equipment *** 3.
LM960 HW Design Guide 4.3.2. Thermal Design Guidelines The thermal design for the power supply heat sink must be done with the following specifications: Average current consumption during RF transmission @PWR level max in LM960 as shown in Section 4.2, Power Consumption table. Information – The average consumption during transmission depends on the power level at which the device is requested to transmit via the network. Therefore, the average current consumption varies significantly.
LM960 HW Design Guide 4.3.3. Power Supply PCB layout Guidelines As seen in the electrical design guidelines, the power supply must have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct operation of the circuitry. A misplaced component can be useless or can even decrease the power supply performances.
LM960 HW Design Guide PIN Signal I/O Function Type Comment 28 VREG_L6_1P8 O Reference Voltage power 1.8V Internal LDO for GNSS bias The LDO for GNSS bias is applied inside the LM960 model. The voltage supply come from LM960’s LDO to GNSS active antenna. This table lists the LDO for GNSS bias of LM960. LM960 Reference Voltage when VBATT is 3.3 Symbol Parameter Min Typ Max Unit VGNSS DC bias Voltage of Internal LDO for GNSS bias 2.9 3.1 3.
LM960 HW Design Guide 5. ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings – Not Operational Caution – A deviation from the value ranges listed below may harm the LM960 module. Absolute Maximum Ratings – Not Operational Symbol VBATT Parameter Battery supply voltage on pin VBATT Min Max Unit -0.5 +4.
LM960 HW Design Guide 6. DIGITAL SECTION Logic Levels Unless otherwise specified, all the interface circuits of the LM960 are 1.8V CMOS logic. Only USIM interfaces are capable of dual voltage I/O. The following tables show the logic level specifications used in the LM960 interface circuits. The data specified in the tables below is valid throughout all drive strengths and the entire temperature ranges.
LM960 HW Design Guide Parameter Min Max Unit IIHPD High-level input leakage current 27.5 97.5 [uA] CI/o I/O capacitance -- 5 [pF] 6.1.3. Comment With pull-down 1.8V SIM Card Pins Operating Range – SIM Pins Working at 1.8V Parameter Min Max Unit Comment VIH Input high level 1.26V 2.1V [V] VIL Input low level -0.3V 0.36V [V] VOH Output high level 1.44V 1.8V [V] VOL Output low level 0V 0.
LM960 HW Design Guide Parameter Min Max Unit Comment IIL Low-level input leakage current -- 1000 [uA] No pull-up IIH High-level input leakage current -20 20 [uA] No pull-down Power On The LM960 is automatically turning on when the VBATT is supplied. Information – To turn on the LM960 module, the SYSTEM_RESET_N pin must not be asserted low. 6.2.1.
LM960 HW Design Guide Information – To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. Power Off To turn off the LM960, SYSTEM_RESET_N pad must be asserted low more than 1 seconds and then it should be kept low.
LM960 HW Design Guide Shutdown by SYSTEM_RESET_N Pad Below figure shows a simple circuit for this action. Circuit for Shutdown by SYSTEM_RESET_N Reset Reset the device can be done in two different ways: • Graceful Reset by USB AT command AT#REBOOT • Unconditional Reset using the SYSTEM_RESET_N 6.4.1. Graceful Reset To gracefully restart the LM960 module, AT#REBOOT AT command must be sent via a USB communication. Graceful Reset by AT#REBOOT 1VV0301485 Rev.
LM960 HW Design Guide 6.4.2. Unconditional Hardware Reset To unconditionally restart the LM960 module, the SYSTEM_RESET_N pin must be asserted low more than 1 seconds and then released. Unconditional Hardware Reset by SYSTEM_RESET_N Pad Information – The Unconditional Hardware Reset must be used only as an emergency exit procedure, and not as a normal power-off operation. Information – Do not use any pull-up resistor on the RESET_N line or any totem pole digital output.
LM960 HW Design Guide I2C I2C (optional) Audio I/F PCM (optional) Antenna ports 4 for Cellular, 1 for GNSS 6.5.1. USB Interface The LM960 module includes super-speed USB3.0 with high-speed USB2.0 backward compatibility. It is compliant with Universal Serial Bus Specification, Revision 3.0 and can be used for control and data transfers as well as for diagnostic monitoring and firmware update. The USB port is typically the main interface between the LM960 module and OEM hardware. USB 3.
LM960 HW Design Guide Warning – At power-up, LM960 success to enumerate SS_USB interface. But if a hot-plug is attempted in case of SS_USB, then LM960 may fail to enumerate SS_USB. Information – According to the mini PCIe standard, TX/RX of SS USB and PCIe share the same pin (Pin 23, 25, 31, 33) so that can not be used at the same time. Currently PCIe interface is not supported but will be enabled soon. Below table lists the USB interface signals.
LM960 HW Design Guide Information – Consider placing a low-capacitance ESD protection component to protect LM960 against ESD strikes If an ESD protection should be added, the suggested connectivity is as follows: ESD Protection for USB2.0 ESD Protection for USB3.0 6.5.2. PCIe Interface The LM960 will support PCIe interface Below table lists the PCIe interface signals. PCIe Interface Signals 1VV0301485 Rev.
LM960 HW Design Guide PIN Signal I/O Function Type 1 PCIE_WAKE_N O PCIe wake-up Analog 7 PCIE_CLKREQ_N I/O 11 PCIE_REFCLK_M I 13 PCIE_REFCLK_P I 22 PCIE_RESET_N I Functional reset to the card Analog 23 PCIE_TX_M O PCIe transmit – minus Analog 25 PCIE_TX_P O PCIe transmit – plus Analog 31 PCIE_RX_M I PCIe receive – minus Analog 33 PCIE_RX_P I PCIe receive – plus Analog PCIe reference clock request signal PCIe differential reference clock – minus PICe differential
LM960 HW Design Guide 6.5.3. SIM Interface The LM960 supports two external SIM interfaces (1.8V or 2.85V). Below table lists the SIM interface signals. SIM Interface Signals PIN Signal I/O Function Type Comment Power SIM Card Interface 1 8 SIMVCC1 O Supply output for an external UIM1 card 1.8V / 2.85V 10 SIMIO1 I/O Data connection with an external UIM1 card 1.8V / 2.85V 12 SIMCLK1 O Clock output to an external UIM1 card 1.8V / 2.
LM960 HW Design Guide Information – LM960 contains an internal pull-up resistor on SIMIO. It is not necessary to install external pull – up resistor. 6.5.4. Control Signals The LM960 supports the following control signals: W_DISABLE_N PCIE_WAKE_N WAN_LED_N Below table lists the control signals of LM960. Module Control Signal PIN Signal I/O 20 W_DISABLE_N I 1 42 PCIE_WAKE_N WAN_LED_N I/O O 6.5.4.1.
LM960 HW Design Guide The recommended WAN_LED_N connection is the following: Recommended WAN_LED_N connection 6.5.5. General Purpose I/O The general-purpose I/O pins can be configured to act in three different ways: Input Output Dedicate Function (Customer Requirement) Input pins can only be read and report digital values (high or low) present on the pin at the read time. Output pins can only be written or queried and set the value of the pin output.
LM960 HW Design Guide 6.5.5.2. Using a GPIO Pin as Output GPIO pins, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pins have a push-pull output, and therefore the pullup resistor can be omitted. GPIO Output Pin Equivalent Circuit 6.5.6. I2C – Inter-integrated circuit The LM960 supports an I2C interface on the following pins: Below table lists the I2C signals of LM960.
LM960 HW Design Guide Using the Temperature Monitor Function The Temperature Monitor permits to monitor the module’s internal temperature and, if properly set (see the #TEMPSENS command in LM960 AT Commands Reference Guide ), raises a GPIO to High Logic level when the maximum temperature is reached. 1VV0301485 Rev.
LM960 HW Design Guide 7. RF SECTION Antenna requirements The antenna connection is one of the most important aspect in the full product design as it strongly affects the product overall performance. Hence read carefully and follow the requirements and the guidelines for a proper design. The LM960 is provided with five RF connectors. The available connectors are: Primary RF antenna #0: Tx and Rx path for low bands and middle bands / 4x4 MIMO path of band41.
LM960 HW Design Guide Antenna Diversity Requirements Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) The bands supported by the LM960 is provided in Section 2.2, Product Variants and Frequency Bands. Impedance 50Ω VSWR recommended ≤ 2:1 The second Rx antenna should not be located in the close vicinity of main antenna.
LM960 HW Design Guide 7.4.1. GNSS RF Front End Design The LM960 contains an integrated LNA and pre-select SAW filter. This allows the module to work well with a passive GNSS antenna. If the antenna cannot be located near the LM960, then an active antenna (that is, an antenna with a low noise amplifier built in) can be used with an external dedicated power supply circuit. GNSS rescive path uses either the dedicated GNSS connector or the shared Secondary #0 antenna connector.
LM960 HW Design Guide 7.5.2. Antenna Connector The LM960 is equipped with a set of 50 Ω RF MHF4 connectors from I-PEX 20449-001. For more information about mating connectors visit the website https://www.i-pex.com 7.5.3. Antenna Cable Connecting cables between the module and the antenna must have 50 Ω impedance. If the impedance of the module is mismatched, RF performance is reduced significantly.
LM960 HW Design Guide Information This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance.
LM960 HW Design Guide 8. AUDIO SECTION Audio Interface The LM960 module supports digital audio interfaces. Digital Audio The LM960 module can be connected to an external codec through the digital interface. The product provides a single Digital Audio Interface on the following pins: Digital Audio Interface Signals Pin no. Signal I/O Function Type 51 DVI_WAO O PCM Frame Sync B-PD 1.8V 49 DVI_RX I PCM Data In B-PD 1.8V 47 DVI _TX O PCM Data Out B-PD 1.
LM960 HW Design Guide 9. MECHANICAL DESIGN General The LM960 module was designed to be compliant with a standard lead-free SMT process. Moreover, it is compatible with the Mini PCIe card 52-pin card edge-type connector. Finishing & Dimensions The LM960 module’s overall dimensions are: Length: 50.95 mm Width: 30.00 mm Thickness: 2.70 mm The module complies with the standard dimensions specified in the PCI Express Mini Card Electromechanical Specification Revision 1.
LM960 HW Design Guide 10.
LM960 HW Design Guide EMC Recommendations EMC protection on the pins in the table below should be designed by application side according to the customer’s requirement. EMC Recommendations Pin Signal I/O Function Type Comment USB HS 2.0 Communication Port 38 USB_D+ I/O USB 2.0 Data Plus Analog 36 USB_D- I/O USB 2.0 Data Minus Analog USB SS 3.0 Communication and PCIe Port 33 USB/PCIE_RX_P I USB 3.0 superspeed/PCIe receive – plus Analog 31 USB/PCIE_RX_M I USB 3.
LM960 HW Design Guide 10 SIMIO1 I/O Data connection with an external UIM1 card 1.8 / 2.85V 8 SIMVCC1 O Supply output for an external UIM1 card 1.8 / 2.85V Power SIM Card Interface 2 6 SIMRST2 O Reset output to an external UIM2 card 1.8 / 2.85V 17 SIMCLK2 O Clock output to an external UIM2 card 1.8 / 2.85V 19 SIMIO2 I/O Data connection with an external UIM2 card 1.8 / 2.85V 16 SIMVCC2 O Supply output for an external UIM2 card 1.8 / 2.
LM960 HW Design Guide 22 PCIE_RESET_N I PCIe Reset Input 1.8V Active Low 48 SYSTEM_RESET_N I Reset Input 1.8V Active Low O LDO out for 1.8V Power 1.8V Voltage Regulator 28 VREG_L6_1P8 All other pins have the following characteristics: Human Body Model (HBM): ± 1000 V Charged Device Model (CDM) JESD22-C101-C: ± 250 V All Antenna pins up to ± 4 kV Warning – Do not touch without proper electrostatic protective equipment.
LM960 HW Design Guide 11. PACKAGING Tray The LM960 modules are packaged on trays of 20 pieces each. These trays can be used in SMT processes for pick & place handling. 1VV0301485 Rev.
LM960 HW Design Guide 1VV0301485 Rev.
LM960 HW Design Guide 12. CONFORMITY ASSESSMENT ISSUES Approvals Fully type approved confirming with RE Directive (Directive 2014/53/EU) CE, GCF FCC, IC, PTCRB RoHS and REACH Approvals for major Mobile Network Operators Declaration of Conformity The DoC is available here: www.telit.com/RED/ FCC certificates The FCC Certifcate is available here: www.fcc.gov/oet/ea/fccid IC certificates The IC Certifcate is available here: https://sms-sgs.ic.gc.
LM960 HW Design Guide brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. RF exposure This equipment complies with FCC and ISED radiation exposure limits set forth for an uncontrolled environment. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. Antenna gain must be below: Cet appareil est conforme aux limites d'exposition aux rayonnements de l’ISED pour un environnement non contrôlé.
LM960 HW Design Guide Antenna List No. Manufacturer Part No. Antenna Type Peak Gain 1.5 dBi for 617 ~ 960 MHz 1 HNS WE14-LF-07 Dipole 3.5 dBi for 1420 ~ 2200 MHz 3 dBi for 2300 ~ 2690 MHz 4 dBi for 1420 ~ 2200 MHz 1 dBi for 2300 ~ 2400 MHz 2 HNS WE14-S3-1 Dipole 3 dBi for 2498 ~ 2690 MHz 3 dBi for 5150 ~ 5928 MHz 3 HNS WE14-S3-2 Dipole 1 dBi for CBRS(3550 ~ 3700 MHz) Note: The antenna connector is SMA(Male) type.
LM960 HW Design Guide Labelling Requirements for the Host device The host device shall be properly labelled to identify the modules within the host device.
LM960 HW Design Guide module must not be incorporated into any other device or system without retesting for compliance as multi-radio and combined equipment. The allowable Antenna Specipication In all cases assessment of the final product must be met against the Essential requirements of the RE Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.3 requirements. 1.
LM960 HW Design Guide 13. SAFETY RECOMMENDATIONS READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. Where there is risk of explosion such as gasoline stations, oil refineries, etc.
LM960 HW Design Guide 14. REFERENCE TABLE OF RF BANDS CHARACTERISTICS RF Bands Characteristics Mode Freq. Tx (MHz) WCDMA 2100 – B1 1920 ~ 1980 WCDMA 1900 – B2 1850 ~ 1910 WCDMA AWS – B4 1710 ~ 1755 WCDMA 850 – B5 824 ~ 849 Freq.
LM960 HW Design Guide Mode LTE 700a – B12 Freq. Tx (MHz) 699 ~ 716 Freq.
LM960 HW Design Guide Mode Freq. Tx (MHz) Freq.
LM960 HW Design Guide 15. ACRONYMS TTSC USB HS DTE UMTS WCDMA HSDPA HSUPA UART HSIC SIM SPI ADC DAC I/O GPIO CMOS MOSI MISO CLK MRDY 1VV0301485 Rev.
LM960 HW Design Guide SRDY CS RTC PCB ESR VSWR VNA FDD I2C LTE SOC 1VV0301485 Rev.
LM960 HW Design Guide 16. DOCUMENT HISTORY Revision Date Changes 0 2018-2-09 First Draft 1 2018-5-30 Sec 1.5 Some of Doc’s Referrence Number Is Updated Sec 3.3 Pin Layout Updated Sec 4.2 Current Consumption Updated Sec 6 Power On, Power Off, Reset Updated 2 2018-7-05 Sec 2.2.1 RF Bands per Regional Variant Upda ted Sec 2.6 Tx output power Updated Sec 2.7 Rx sensitivity Updated Sec 2.8.2 Weight Updated Sec 4.2 Current Consumption Updated Sec 6.5.1 USB Block Diagram Updated Sec 6.5.
[01.2017] Mod.0818 2017-01 Rev.
