User's Manual

LE940B6 Hardware User Guide
1VV0301331 Rev. 1.8 - 2017-03-15
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The PCB must be able to resist the higher temperatures, which occur during the lead-free process.
This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-lead solder
paste on the described surface plating is better compared to lead-free solder paste.
10.7. Solder Paste
We recommend using only “no clean” solder paste to avoid the cleaning of the modules after
assembly.
10.7.1. Solder Reflow
Figure 26 shows the recommended solder reflow profile.
Figure 26: Solder Reflow Profile