User's Manual

LE940B6 Hardware User Guide
1VV0301331 Rev. 1.8 - 2017-03-15
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10.6. Recommendations for PCB Pad Dimensions (mm)
Figure 24: PCB Pad Dimensions
It is not recommended to place around the pads a via or micro-via that is not covered by solder
resist in an area of 0.3 mm unless it carries the same signal as the pad itself (see Figure 25).
Figure 25: Inhibit Area for Micro-via
Holes in pad are allowed only for blind holes and not for through holes.
Table 37: Recommendations for PCB Pad Surfaces
Finish Layer Thickness (um) Properties
Electro-less Ni / Immersion Au 3-7 / 0.05-0.15 Good solder ability
protection, high shear force
values