User's Manual

LE940B6 Hardware User Guide
1VV0301331 Rev. 1.8 - 2017-03-15
Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved
Telit Confidential Information, provided under NDA Page
86 of 104
10.3. Recommended Footprint for the Application
Figure 22 shows the top view of the module, which has 334 pads (dimensions are in mm).
To facilitate replacing the LE940B6 module if necessary, it is suggested to design the application
board with a 1.5 mm placement inhibit area around the module. These regions are highlighted in
Figure 22.
It is also suggested, as a common rule for an SMT component, to avoid having a mechanical part
of the application board in direct contact with the module.
NOTE:
In the customer application, the region marked as INHIBIT WIRING in Figure 22 must be clear of
signal wiring or ground polygons.
Figure 22: Application Module Top View