User's Manual
LE940B6 Hardware User Guide
1VV0301331 Rev. 1.8 - 2017-03-15
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10.
Mounting the Module on your Board ............................................................... 85
10.1.
General ............................................................................................................. 85
10.2.
Finishing & Dimensions .................................................................................... 85
10.3.
Recommended Footprint for the Application ................................................. 86
10.4.
Stencil ............................................................................................................... 87
10.5.
PCB Pad Design ................................................................................................ 87
10.6.
Recommendations for PCB Pad Dimensions (mm) .......................................... 88
10.7.
Solder Paste ..................................................................................................... 89
10.7.1.
Solder Reflow ........................................................................................ 89
11.
Application Guide ............................................................................................ 91
11.1.
Debug of the LE940B6 Module in Production ................................................. 91
11.2.
Bypass Capacitor on Power Supplies ............................................................... 92
11.3.
SIM Interface .................................................................................................... 93
11.3.1.
SIM Schematic Example ........................................................................ 93
11.4.
EMC Recommendations ................................................................................... 94
11.5.
Download and Debug Port ............................................................................... 94
11.6.
Antenna Detection ........................................................................................... 95
12.
Packing System ................................................................................................ 96
12.1.
Tray Drawing .................................................................................................... 98
12.2.
Moisture Sensitivity ......................................................................................... 98
13.
Conformity Assessment Issues ......................................................................... 99
13.1.
FCC/IC Regulatory Notices ............................................................................... 99
14.
Safety Recommendations ................................................................................ 101
15.
Document History ........................................................................................... 102