User's Manual

LE920 Hardware User Guide
1vv0301026 Rev.8 2015-01-03
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Reserved. Page 71 of 88
14.4. Stencil
Stencil’s apertures layout can be the same as the recommended footprint (1:1). A suggested
thickness of stencil foil is greater than 120 µm.
14.5. PCB Pad Design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.