User's Manual
LE920 Hardware User Guide
1vv0301026 Rev.8 2015-01-03
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights
Reserved. Page 7 of 88
10. Peripheral Ports ............................................ 57
10.1. SPI – Serial Peripheral Interface ...................... 57
10.2. I2C - Inter-integrated circuit ......................... 58
10.3. SDIO – Secure Digital I/O .............................. 58
10.4. Wi-Fi (SDIO) control Interface ......................... 60
11. Audio Section Overview ...................................... 61
11.1. Analog Audio ........................................... 61
11.2. Digital Audio .......................................... 61
12. General Purpose I/O ......................................... 63
12.1. Logic Level Specifications ............................. 64
12.2. Using a GPIO Pad as Input .............................. 64
12.3. Using a GPIO Pad as Output ............................. 65
12.4. Using the Temperature Monitor Function ................. 65
12.4.1. Short Description ........................................ 65
12.5. Indication of Network Service Availability ............. 66
12.6. RTC Bypass ............................................. 67
12.7. VAUX Power Output ...................................... 67
13. ADC section ................................................. 68
13.1. ADC Converter .......................................... 68
13.1.1. Description .............................................. 68
13.1.2. Using ADC Converter ...................................... 68
14. Mounting the module on your board ........................... 69
14.1. General ................................................ 69
14.2. Finishing & Dimensions ................................. 69
14.3. Recommended foot print for the application ............. 70
14.4. Stencil ................................................ 71
14.5. PCB Pad Design ......................................... 71
14.6. Recommendations for PCB Pad Dimensions (mm) ............ 72
14.7. Solder Paste ........................................... 73
14.7.1. Solder Reflow ............................................ 73
15. Application guide ........................................... 75