User's Manual

L
LE920 Hardware User Guide
1vv0301026 Rev.0 - draft4 – 2013-05-
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 7 of 76
10.1. Digital Audio ........................................................................................................... 54
11.
General Purpose I/O .......................................................................................... 56
11.1. Logic Level Specifications ...................................................................................... 57
11.2. Using a GPIO Pad as Input ...................................................................................... 57
11.3. Using a GPIO Pad as Output ................................................................................... 58
11.4. Using the Temperature Monitor Function ............................................................. 59
11.4.1. Short Description ........................................................................................................... 59
11.5. Indication of Network Service Availability .............................................................. 59
11.6. RTC Bypass Out ...................................................................................................... 60
11.7. VAUX Power Output ................................................................................................ 60
12.
ADC section ...................................................................................................... 61
12.1. ADC Converter ........................................................................................................ 61
12.1.1. Description ..................................................................................................................... 61
12.1.2. Using ADC Converter ..................................................................................................... 61
13.
Mounting the module on your board .................................................................. 62
13.1. General ................................................................................................................... 62
13.2. Finishing & Dimensions ......................................................................................... 62
13.3. Recommended foot print for the application ......................................................... 63
13.4. Stencil ..................................................................................................................... 64
13.5. PCB Pad Design ...................................................................................................... 64
13.6. Recommendations for PCB Pad Dimensions (mm)............................................... 64
13.7. Solder Paste ........................................................................................................... 66
13.7.1. Solder Reflow ................................................................................................................. 66
14.
Application guide .............................................................................................. 68
14.1. Debug of the LE920 in production .......................................................................... 68
14.2. Bypass capacitor on Power supplies ..................................................................... 69
14.3. SIM interface........................................................................................................... 69
14.4. EMC recommendations (TBD) ................................................................................ 70
14.5. Download and Debug Port ...................................................................................... 71