User's Manual

L
LE920 Hardware User Guide
1vv0301026 Rev.0 - draft4 – 2013-05-
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 64 of 76
13.4.
Stencil
Stencil’s apertures layout can be the same as the recommended footprint (1:1). A suggested
thickness of stencil foil is greater than 120 µm.
13.5.
PCB Pad Design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
PCB
PCB
Solder maskCopper pad
Solder Mask Defined
Copper pad
Non Solder Mask Defined
13.6.
Recommendations for PCB Pad Dimensions (mm)