User's Manual

LE920A4 HW User Guide Packing System
Doc#: 1VV0301261 Tray
Rev. 4.3 Page 108 of 123 2017-12-07
12. Packing System
Tray
The module can be packed on trays.
The tray is JEDEC compliant, injection molded antistatic Modified Polyphenylene ether
(MPPO). It has good thermal characteristics and can withstand a standard baking
temperature of up to 125°C, thereby avoiding handling the modules if baking is required.
The trays are rigid, thus providing mechanical protection against transport stress. In
addition, they are re-usable and so environmentally sustainable.
There are 2 (two) antistatic rubber bands that enclose each envelope.
The carton box is rigid, offering mechanical protection. The carton box has one flap across
the entire top surface. It is sealed with tape along the edges of the box.
Table 49: Tray Packing
Modules per
Tray
Trays per
Envelope
Modules per
Envelope
Envelopes per
Carton Box
Modules per
Box
24 5 + 1 empty 120 4 480
Table 50: Packing Quantities
Order Type Quantity
Minimum Order Quantity (MOQ) 24
Standard Packing Quantity (SPQ) 480