User's Manual

LE920A4 HW User Guide Mounting the Module on Your Board
Doc#: 1VV0301261 Solder Paste
Rev. 4.3 Page 102 of 123 2017-12-07
Profile Feature Pb-Free Assembly
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up rate 3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak temperature (Tp) 245 +0/-5°C
Time within 5°C of actual peak temperature (tp) 10-30 seconds
Ramp-down rate 6°C/second max.
Time 25°C to peak temperature 8 minutes max.
NOTE:
All temperatures refer to the top side of the package, measured on the
package body surface.
WARNING:
The module withstands one reflow process only.