User's Guide

LE910 V2 HARDWARE USER GUIDE 1VV0301200 Rev.8 • 2016-10-07 72 of 84
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9.4 Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness of stencil
foil ≥ 120 µm.
9.5 Solder paste
Item
Lead Free
Solder Paste
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after assembly.
9.6 Solder reflow
Recommended solder reflow profile: