User's Manual
LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 66 of 79
Lead free
Solder paste
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules
after assembly.
Recommended solder reflow profile: