User's Manual

LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 63 of 79
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we
suggest a thickness of stencil foil ≥ 120 µm.
Non solder mask defined (NSMD) type is recommended for the solder pads on the
PCB.
PCB
Copper Pad
Solder Mask
SMD
(Solder Mask Defined)
NSMD
(Non Solder Mask Defined)