User's Manual

LE910 Hardware User Guide
1vv0301089 Rev.3 – 09-06-2014
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 6 of 79
9 UNCONDITIONAL SHUTDOWN ................................................................................................................................ 47
10 USB PORT ................................................................................................................................................................ 48
10.1 USB 2.0 HS DESCRIPTION ................................................................................................................................................. 48
11 SERIAL PORTS .......................................................................................................................................................... 49
11.1 MODEM SERIAL PORT 1 ............................................................................................................................................... 50
11.2 MODEM SERIAL PORT 2 (USIF1) ................................................................................................................................... 51
11.3 RS232 LEVEL TRANSLATION ................................................................................................................................................ 52
12 AUDIO SECTION OVERVIEW .................................................................................................................................... 54
12.1 ELECTRICAL CHARACTERISTICS ............................................................................................................................................. 54
13 GENERAL PURPOSE I/O ........................................................................................................................................... 55
13.1 GPIO LOGIC LEVELS .......................................................................................................................................................... 56
13.2 USING A GPIO PAD AS INPUT ........................................................................................................................................... 56
13.3 USING A GPIO PAD AS OUTPUT ........................................................................................................................................ 56
13.4 INDICATION OF NETWORK SERVICE AVAILABILITY ..................................................................................................................... 57
13.5 RTC BYPASS OUT ............................................................................................................................................................. 58
13.6 VAUX POWER OUTPUT ..................................................................................................................................................... 58
13.7 ADC CONVERTER ............................................................................................................................................................. 59
13.7.1 Description ........................................................................................................................................................... 59
13.7.2 Using ADC Converter ............................................................................................................................................ 59
14 MOUNTING THE LE910 ON THE APPLICATION ......................................................................................................... 60
14.1 GENERAL ........................................................................................................................................................................ 60
14.2 MODULE FINISHING & DIMENSIONS ..................................................................................................................................... 60
14.3 RECOMMENDED FOOT PRINT FOR THE APPLICATION ................................................................................................................. 62
14.4 STENCIL .......................................................................................................................................................................... 63
14.5 PCB PAD DESIGN .............................................................................................................................................................. 63
14.6 PCB PAD DIMENSIONS ....................................................................................................................................................... 64
14.7 SOLDER PASTE .................................................................................................................................................................. 66
14.7.1 LE910 Solder reflow .............................................................................................................................................. 66
14.8 PACKING SYSTEM (TRAY) .................................................................................................................................................... 68
14.9 PACKING SYSTEM (REEL) .................................................................................................................................................... 70
14.9.1 Carrier Tape Detail ............................................................................................................................................... 70
14.9.2 Reel Detail ............................................................................................................................................................ 71
14.9.3 Packaging Detail .................................................................................................................................................. 72
14.10 MOISTURE SENSITIVITY .................................................................................................................................................... 72
15 SAFETY RECOMMANDATIONS ................................................................................................................................. 73
16 CONFORMITY ASSESSMENT ISSUES ......................................................................................................................... 74
16.1 1999/5/EC DIRECTIVE ..................................................................................................................................................... 74
16.2 FCC/IC REGULATORY NOTICES ............................................................................................................................................ 77