User's Manual

ManualsBrandsTelit Communications ManualsElectronicsLE910-NAG LTE/HSPA/GPRS/GSM module supporting frequency bands GSM/GPRS 850/1900, HSPA FDD II and FDDV and LTE FDD 2, 4, 5 and 17

LE910 Hardware User Guide

1vv0301089 Rev.7 – 25-10-2015

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 75 of 88

16.7 Solder paste

Lead free

Solder paste

Sn/Ag/Cu

We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules

after assembly.

16.7.1 LE910 Solder reflow

Recommended solder reflow profile: