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User's Manual

ManualsBrandsTelit Communications ManualsElectronicsLE910-NAG LTE/HSPA/GPRS/GSM module supporting frequency bands GSM/GPRS 850/1900, HSPA FDD II and FDDV and LTE FDD 2, 4, 5 and 17
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LE910 Hardware User Guide
1vv0301089 Rev.7 – 25-10-2015
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 74 of 88
It is not recommended to place via or micro-via not covered by solder resist in an
area of 0,3 mm around the pads unless it carries the same signal of the pad itself
(see following figure).
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
Layer thickness [µm]
Properties
Electro-less Ni / Immersion
Au
3 –7 / 0.05 – 0.15
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the
lead-free process. This issue should be discussed with the PCB-supplier. Generally,
the wettability of tin-lead solder paste on the described surface plating is better
compared to lead-free solder paste.
It is not necessary to panel the application’s PCB, however in that case it is
suggested to use milled contours and predrilled board breakouts; scoring or v-cut
solutions are not recommended.
Inhibit area for micro-via