User's Manual

LE910 Hardware User Guide
1vv0301089 Rev.7 – 25-10-2015
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16.4 Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we
suggest a thickness of stencil foil ≥ 120 µm.
16.5 PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads on the
PCB.
PCB
Copper Pad
Pad
Solder Mask
SMD
(Solder Mask Defined)
NSMD
(Non Solder Mask Defined)