User's Manual

LE910 Hardware User Guide
1vv0301089 Rev.7 – 25-10-2015
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7.2 GNSS SIGNALS PINOUT ....................................................................................................................................................... 49
7.3 GPS/GLONASS ANTENNA REQUIREMENTS ............................................................................................................................ 50
7.3.1 GNSS Antenna - PCB Line Guidelines ...................................................................................................................... 50
7.3.2 RF Trace Losses....................................................................................................................................................... 51
7.3.3 GNSS Antenna - Installation ................................................................................................................................... 51
8 LOGIC LEVEL SPECIFICATIONS .................................................................................................................................. 52
9 UNCONDITIONAL SHUTDOWN ................................................................................................................................ 53
10 USB PORT ................................................................................................................................................................ 54
10.1 USB 2.0 HS DESCRIPTION ................................................................................................................................................. 54
11 SERIAL PORTS .......................................................................................................................................................... 55
11.1 MODEM SERIAL PORT 1 ............................................................................................................................................... 56
11.2 MODEM SERIAL PORT 2 (USIF1) ................................................................................................................................... 57
11.3 RS232 LEVEL TRANSLATION ................................................................................................................................................ 58
12 PERIPHERAL PORTS ................................................................................................................................................. 60
12.1 WI-FI (SDIO) CONTROL INTERFACE ..................................................................................................................................... 60
13 AUDIO SECTION OVERVIEW .................................................................................................................................... 61
13.1 ELECTRICAL CHARACTERISTICS ............................................................................................................................................. 61
14 GENERAL PURPOSE I/O ........................................................................................................................................... 62
14.1 GPIO LOGIC LEVELS .......................................................................................................................................................... 62
14.2 USING A GPIO PAD AS INPUT ........................................................................................................................................... 63
14.3 USING A GPIO PAD AS OUTPUT ........................................................................................................................................ 63
14.4 INDICATION OF NETWORK SERVICE AVAILABILITY ..................................................................................................................... 64
14.5 RTC BYPASS OUT ............................................................................................................................................................. 66
14.6 VAUX POWER OUTPUT ..................................................................................................................................................... 66
14.7 ADC CONVERTER ............................................................................................................................................................. 67
14.7.1 Description ........................................................................................................................................................... 67
14.7.2 Using ADC Converter ............................................................................................................................................ 67
15 APPLICATION GUIDE ................................................................................................................................................ 68
15.1 DOWNLOAD AND DEBUG PORT ........................................................................................................................................... 68
16 MOUNTING THE LE910 ON THE APPLICATION ......................................................................................................... 69
16.1 GENERAL ........................................................................................................................................................................ 69
16.2 MODULE FINISHING & DIMENSIONS ..................................................................................................................................... 69
16.3 RECOMMENDED FOOT PRINT FOR THE APPLICATION ................................................................................................................. 71
16.4 STENCIL .......................................................................................................................................................................... 72
16.5 PCB PAD DESIGN .............................................................................................................................................................. 72
16.6 PCB PAD DIMENSIONS ....................................................................................................................................................... 73
16.7 SOLDER PASTE .................................................................................................................................................................. 75
16.7.1 LE910 Solder reflow .............................................................................................................................................. 75
16.8 PACKING SYSTEM (TRAY) .................................................................................................................................................... 77
16.9 PACKING SYSTEM (REEL) .................................................................................................................................................... 79
16.9.1 Carrier Tape Detail ............................................................................................................................................... 79