User's Guide

LE910Cx HW User Guide
Doc#: 1VV0301298
Rev. 13.0 Page 99 of 124 2019-07-15
10.7.2. Cleaning
In general, cleaning the module mounted on the carrier board is not recommended.
• Residues between module and host board cannot be easily removed with any
cleaning method.
• Cleaning with water or any organic solvent can lead to capillary effects where the
cleaning solvent is absorbed into the gap between the module and the host board
or even leak inside the module (due to the gap between the module shield and
PCB) . The combination of soldering flux residues and encapsulated solvent could
lead to short circuits between conductive parts. The solvent could also damage the
module label.
• Ultrasonic cleaning could damage the module permanently. Especially for crystal
oscillators where the risk of damaging is very high.