User's Guide

LE910Cx HW User Guide
Doc#: 1VV0301298
Rev. 13.0 Page 97 of 124 2019-07-15
Solder Paste
We recommend using only “no clean” solder paste to avoid the cleaning of the modules
after assembly.
10.7.1. Solder Reflow
Figure 29 shows the recommended solder reflow profile.
Figure 29: Solder Reflow Profile
WARNING:
The above solder reflow profile represents the typical SAC reflow limits and
does not guarantee adequate adherence of the module to the customer
application throughout the temperature range. Customer must optimize the
reflow profile depending on the overall system taking into account such
factors as thermal mass and warpage