User's Guide

LE910Cx HW User Guide
Doc#: 1VV0301298
Rev. 13.0 Page 96 of 124 2019-07-15
Recommendations for PCB Pad Dimensions (mm)
Figure 28: PCB Pad Dimensions
It is not recommended to place around the pads a via or micro-via that is not covered by
solder resist in an area of 0.15 mm unless it carries the same signal as the pad itself. Micro
via inside the pads are allowed.
Holes in pad are allowed only for blind holes and not for through holes.
Table 40: Recommendations for PCB Pad Surfaces
Finish
Layer Thickness (um)
Properties
Electro-less Ni / Immersion
Au
3-7 / 0.05-0.15
Good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures, which occur during the lead-free
process. This issue should be discussed with the PCB-supplier. Generally, the wettability
of tin-lead solder paste on the described surface plating is better compared to lead-free
solder paste.