User's Guide

LE910Cx HW User Guide
Doc#: 1VV0301298
Rev. 13.0 Page 95 of 124 2019-07-15
Stencil
Stencil’s apertures layout can be the same as the recommended footprint (1:1). The
suggested thickness of stencil foil is greater than 120 µm.
PCB Pad Design
The solder pads on the PCB are recommended to be of the Non-Solder Mask Defined
(NSMD) type.
Figure 27: PCB Pad Design