User's Guide

LE910Cx Hardware User Guide
1VV0301298 Rev. 1.04 - 2017-05-25
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9.2. Indication of Software Ready ........................................................................... 90
9.3. RTC – Real Time Clock ...................................................................................... 90
9.4. VAUX Power Output ........................................................................................ 90
9.5. ADC Converter ................................................................................................. 91
9.5.1. Description............................................................................................ 91
9.5.2. Using the ADC Converter ...................................................................... 91
9.6. Using the Temperature Monitor Function ...................................................... 91
9.7. GNSS Characteristics ........................................................................................ 92
10. Mounting the Module on your Board ............................................................... 93
10.1. General ............................................................................................................. 93
10.2. Finishing & Dimensions .................................................................................... 93
10.3. Recommended Footprint for the Application ................................................. 96
10.4. Stencil ............................................................................................................... 97
10.5. PCB Pad Design ................................................................................................ 97
10.6. Recommendations for PCB Pad Dimensions (mm) .......................................... 98
10.7. Solder Paste ..................................................................................................... 99
10.7.1. Solder Reflow ........................................................................................ 99
11. Application Guide ........................................................................................... 101
11.1. Debug of the LE910Cx Module in Production ................................................ 101
11.2. Bypass Capacitor on Power Supplies ............................................................. 102
11.3. SIM Interface .................................................................................................. 103
11.3.1. SIM Schematic Example ...................................................................... 103
11.4. EMC Recommendations ................................................................................. 104
11.5. Download and Debug Port ............................................................................. 105
11.5.1. Fast Boot mode................................................................................... 105
11.5.2. Recovery Boot Mode .......................................................................... 105
12. Packing System ............................................................................................... 106
12.1. Packing system – Tray .................................................................................... 106
12.2. Tape & Reel .................................................................................................... 108
12.3. Moisture Sensitivity ....................................................................................... 110