User's Guide

LE910Cx Hardware User Guide
1VV0301298 Rev. 1.01 - 2016-02-16
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9.3. RTC – Real Time Clock ...................................................................................... 88
9.4. VAUX Power Output ........................................................................................ 88
9.5. ADC Converter ................................................................................................. 89
9.5.1. Description............................................................................................ 89
9.5.2. Using the ADC Converter ...................................................................... 89
9.6. Using the Temperature Monitor Function ...................................................... 89
9.7. GNSS Characteristics ........................................................................................ 90
10. Mounting the Module on your Board ............................................................... 91
10.1. General ............................................................................................................. 91
10.2. Finishing & Dimensions .................................................................................... 91
10.3. Recommended Footprint for the Application ................................................. 94
10.4. Stencil ............................................................................................................... 95
10.5. PCB Pad Design ................................................................................................ 95
10.6. Recommendations for PCB Pad Dimensions (mm) .......................................... 96
10.7. Solder Paste ..................................................................................................... 97
10.7.1. Solder Reflow ........................................................................................ 97
11. Application Guide ............................................................................................ 99
11.1. Debug of the LE910Cx Module in Production .................................................. 99
11.2. Bypass Capacitor on Power Supplies ............................................................. 100
11.3. SIM Interface .................................................................................................. 101
11.3.1. SIM Schematic Example ...................................................................... 101
11.4. EMC Recommendations ................................................................................. 102
11.5. Download and Debug Port ............................................................................. 103
11.5.1. Fast Boot mode................................................................................... 103
11.5.2. Recovery Boot Mode .......................................................................... 103
12. Packing System ............................................................................................... 104
12.1. Packing system – Tray .................................................................................... 104
12.2. Tape & Reel .................................................................................................... 106
12.3. Moisture Sensitivity ....................................................................................... 108