LE910Cx HW User Guide Doc#: 1VV0301298 Rev. 14.
LE910Cx HW User Guide Doc#: 1VV0301298 SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE NOTICE While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions.
LE910Cx HW User Guide Doc#: 1VV0301298 USAGE AND DISCLOSURE RESTRICTIONS I. License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. II. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law.
LE910Cx HW User Guide Doc#: 1VV0301298 APPLICABILITY TABLE This documentation applies to the following products: Table 1: Applicability Table Module Name Description LE910C1-NA North America – AT&T with global roaming LE910C1-NS North America - Sprint variant LE910C1-AP APAC variant CAT1 variant LE910C4-AP APAC variant CAT4 variant LE910C4-EU Europe CAT4 variant LE910C1-EU Europe CAT1 variant LE910C4-NF North America CAT4 variant LE910C1-NF North America CAT1 variant LE910C1-SA North Ame
LE910Cx HW User Guide Doc#: 1VV0301298 CONTENTS 1. INTRODUCTION .............................................................................................9 Scope ............................................................................................................. 9 Audience......................................................................................................... 9 Contact Information, Support ..........................................................................
LE910Cx HW User Guide Doc#: 1VV0301298 4.3.4. 1.8V SIM Card Pads ......................................................................................40 4.3.5. Dual Voltage Pads - Absolute Maximum Ratings ...........................................40 4.3.6. SD Card Pads @ 2.95V .................................................................................40 4.3.7. SIM Card Pads @2.95V.................................................................................41 5. HARDWARE COMMANDS .......
LE910Cx HW User Guide Doc#: 1VV0301298 HSIC Interface (Optional)...............................................................................68 SGMII Interface..............................................................................................68 8.3.1. Ethernet Control interface ..............................................................................68 Serial Ports ....................................................................................................70 8.4.1.
LE910Cx HW User Guide Doc#: 1VV0301298 10.7.1. Solder Reflow ................................................................................................97 10.7.2. Cleaning ........................................................................................................99 11. APPLICATION GUIDE ................................................................................ 100 Debug of the LE910Cx Module in Production ..............................................
LE910Cx HW User Guide Doc#: 1VV0301298 1. Introduction Scope This document introduces the Telit LE910Cx module and presents possible and recommended hardware solutions for developing a product based on the LE910Cx module. All the features and solutions detailed in this document are applicable to all LE910Cx variants, where “LE910Cx” refers to the variants listed in the applicability table. If a specific feature is applicable to a specific product only, it will be clearly marked.
LE910Cx HW User Guide Doc#: 1VV0301298 Alternatively, use: http://www.telit.com/support For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit: http://www.telit.com To register for product news and announcements or for product questions contact Telit’s Technical Support Center (TTSC). Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.
LE910Cx HW User Guide Doc#: 1VV0301298 Related Documents Table 2: Related Documents Document Title Document Number Ref 1: LE920x4/LE910Cx AT Command User Guide 80490ST10778A Ref 2: Telit EVB HW User Guide 1VV0301249 Ref 3: LE910Cx Interface Board HW User Guide 1VV0301323 Ref 4: LE910/LE920 Digital Voice Interface Application Note 80000NT11246A Ref 5: Telit_LE920A4_LE910Cx_WiFi_Interface_Application_Note_r1 80490NT11511A Ref 6: Antenna Detection Application Note 80000NT10002A Ref 7: High-Speed
LE910Cx HW User Guide Doc#: 1VV0301298 2. Product Description Overview LE910Cx is Telit’s new LTE series for IoT applications. In its most basic use case, LE910Cx can be applied as a wireless communication frontend for telematics products, offering GNSS and mobile communication features to an external host CPU through its rich interfaces. LE910Cx is available in hardware variants as listed in Table 1: Applicability Table. For differences in the designated RF band sets – refer to Section 2.6.
LE910Cx HW User Guide Doc#: 1VV0301298 Applications LE910Cx can be used for telematics applications where tamper-resistance, confidentiality, integrity, and authenticity of end-user information are required, for example: Emergency call Telematics services Road pricing Pay-as-you-drive insurance Stolen vehicles tracking Internet connectivity General Functionality and Main Features The LE910Cx series of cellular modules features an LTE and multi-RAT modem together with a powerful on-chip applic
LE910Cx HW User Guide Doc#: 1VV0301298 Function Interfaces Features Rich set of interfaces, including: SD/MMC Card Interface supporting SD3.0 standard SDIO for external WiFi transceiver supporting SDIO3.0 standard SGMII for external Ethernet transceiver o o o o o USB2.0 – USB port is typically used for: o o o o o o o Compliant with IEEE802.
LE910Cx HW User Guide Doc#: 1VV0301298 Function Operating temperature Features Range -40 °C to +85 °C (conditions as defined in Section 2.5.1, Temperature Range). NOTE: The following interfaces are unique for the LE910Cx and may not be supported on other (former or future) xE910 family. Special care must be taken when designing the application board if future compatibility is required: - SGMII for Ethernet connectivity - SDIO for WIFI connectivity - SD/MMC for SD Card connectivity Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 Block Diagram Figure 1 shows an overview of the internal architecture of the LE910Cx module. It includes the following sub-functions: Application processor, Modem subsystem and Location processing with their external interfaces. These three functions are contained in a single SOC. RF front end and antenna ports. Digital Audio interface for external codec. Rich IO interfaces.
LE910Cx HW User Guide Doc#: 1VV0301298 Environmental Requirements 2.5.1. Temperature Range Operating temperature range -40 ~ +85°C Ambient. Storage and nonoperating temperature range –40°C ~ +90°C 2.5.2. Temperatures outside of the range –20°C ÷ +55°C might slightly deviate from ETSI specifications. The module is fully functional, able to make and receive voice calls, data calls, SMS and GPRS traffic.
LE910Cx HW User Guide Doc#: 1VV0301298 Operating Frequency Bands The operating frequencies in GSM850, EGSM900, DCS1800, PCS1900, WCDMA & LTE modes conform to the 3GPP specifications. 2.6.1. RF Bands per Regional Variant Table 4 summarizes all region variants within the LE910Cx family, showing the supported band sets in each variant.
LE910Cx HW User Guide Doc#: 1VV0301298 2.6.2. Reference Table of RF Bands Characteristics Table 5: RF Bands Characteristics Mode Tx-Rx Offset Freq. Tx (MHz) Freq. Rx (MHz) Channels PCS 1900 1850.2 ~ 1909.8 1930.2 ~ 1989.8 512 ~ 810 80 MHz DCS 1800 1710 ~ 1785 1805 ~ 1880 512 ~ 885 95 MHz GSM 850 824.2 ~ 848.8 869.2 ~ 893.
LE910Cx HW User Guide Doc#: 1VV0301298 Mode Freq. Tx (MHz) Freq. Rx (MHz) LTE 1900 – B2 1850 ~ 1910 1930 ~ 1990 LTE 1800 – B3 1710 ~ 1785 1805 ~ 1880 LTE AWS – B4 1710 ~ 1755 2110 ~ 2155 LTE 850 – B5 824 ~ 849 869 ~ 894 LTE 2600 – B7 2500 ~ 2570 2620 ~ 2690 LTE 900 – B8 880 ~ 915 925 ~ 960 LTE 1800 – B9 1749.9 ~ 1784.9 1844.9 ~ 1879.
LE910Cx HW User Guide Doc#: 1VV0301298 Mode Freq. Tx (MHz) Freq. Rx (MHz) LTE 1900+ – B25 1930 ~ 1995 1850 ~ 1915 LTE 850+ – B26 814 ~ 849 859 ~ 894 LTE 700 – B28A 703 ~ 733 758 ~ 788 LTE 700 – B28 703 ~ 748 758 ~ 803 LTE AWS-3 – B66 1710 ~ 1780 2210 ~ 2200 LTE600 – B71 663 ~ 698 617 ~ 652 LTE TDD 2600 – B38 2570 ~ 2620 2570 ~ 2620 LTE TDD 1900 – B39 1880 ~ 1920 1880 ~ 1920 LTE TDD 2300 – B40 2300 ~ 2400 2300 ~ 2400 LTE TDD 2500 – B41M 2555 ~ 2655 2555 ~ 2655 Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 RF Parameters 2.7.1. Sensitivity Typical sensitivity levels are as follows: -108 dBm @ 2G -112 dBm @ 3G -102 dBm @ 4G FDD (BW=5 MHz) 2.7.2. Output power Typical values for Max output level are as follow: 2G: - LB: 32.5dBm ±0.5dBm - HB: 29.5dBm ±0.5dBm 3G/TD-SCDMA: 23.5dBm ±0.5dBm 4G (FDD & TDD): 23dBm ±0.5dBm @1RB Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 Mechanical Specifications 2.8.1. Dimensions The module’s overall dimensions are: Length: Width: Thickness: 28.2 mm, +/- 0.15 mm tolerance 28.2 mm, +/- 0.15 mm tolerance 2.2 mm, +/- 0.15 mm tolerance NOTE: LE910C1-SV’s thickness is only 2.3mm, +/- 0.15 mm tolerance. NOTE: Consider a typical label thickness of 0.1 mm in addition to the module thickness. 2.8.2. Weight The nominal weight of the LE910Cx module is 9.0 gram. Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 3. Module Connections Pin-out Table 6: Pin-out PAD Signal I/O Function Type Comment USB HS 2.0 Communication Port B15 USB_D+ I/O USB differential Data (+) C15 USB_D- I/O USB differential Data (-) A13 USB_VBUS AI Power sense for the internal USB transceiver A14 USB_ID AI USB ID Power See note below Asynchronous UART N15 C103/TXD I Serial data input (TXD) from DTE 1.8V M15 C104/RXD O Serial data output to DTE 1.
LE910Cx HW User Guide Doc#: 1VV0301298 PAD Signal I/O Function Type Comment SD/MMC Card Digital I/O J12 SD/MMC_CMD O SD Command 1.8/2.95V F12 SD/MMC_CLK O SD Card Clock 1.8/2.95V E12 SD/MMC_DATA0 I/O SD Serial Data 0 1.8/2.95V G12 SD/MMC_DATA1 I/O SD Serial Data 1 1.8/2.95V K12 SD/MMC_DATA2 I/O SD Serial Data 2 1.8/2.95V H12 SD/MMC_DATA3 I/O SD Serial Data 3 1.8/2.95V G13 SD/MMC_CD I SD card detect input 1.
LE910Cx HW User Guide Doc#: 1VV0301298 PAD Signal I/O Function Type Comment A5 SIMIO1 I/O External SIM 1 signal - Data I/O 1.8/2.85V Internally PU 10 kΩ to SIMVCC1 A4 SIMIN1 I External SIM 1 signal Presence 1.8V Active low A3 SIMVCC1 - External SIM 1 signal – Power supply for SIM 1 1.8/2.85V SIM Card Interface 2 C1 SIMCLK2 O External SIM 2 signal – Clock 1.8/2.85V D1 SIMRST2 O External SIM 2 signal – Reset 1.8/2.85V C2 SIMIO2 I/O External SIM 2 signal – Data I/O 1.8/2.
LE910Cx HW User Guide Doc#: 1VV0301298 PAD Signal I/O Function Type Comment B14 GPIO_05 I/O GPIO_05 1.8V Alternate Fn I2C C12 GPIO_06 I/O GPIO_06 1.8V Alternate Fn I2C C13 GPIO_07 I/O GPIO_07 1.8V Alternate Fn I2C K15 GPIO_08 I/O GPIO_08 / SW_RDY 1.8V Alternate Fn I2C L15 GPIO_09 I/O GPIO_09 1.8V Alternate Fn I2C G15 GPIO_10 I/O GPIO_10 1.
LE910Cx HW User Guide Doc#: 1VV0301298 PAD D7 Signal ADC_IN3 I/O Function Type AI Analog/Digital Converter Input 3 Analog Comment SGMII Interface E4 SGMII_RX_P AI SGMII receive – plus PHY F4 SGMII_RX_M AI SGMII receive – minus PHY D5 SGMII_TX_P AO SGMII transmit – plus PHY D6 SGMII_TX_M AO SGMII transmit - minus PHY HSIC Interface A12 HSIC_DATA I/O High-speed inter-chip interface - data 1.2V Optional A11 HSIC_STB I/O High-speed inter-chip interface - strobe 1.
LE910Cx HW User Guide Doc#: 1VV0301298 PAD Signal I/O Function E1 GND - Ground E2 GND - Ground E14 GND - Ground F2 GND - Ground G1 GND - Ground G2 GND - Ground G7 GND - Ground G8 GND - Ground G9 GND - Ground H1 GND - Ground H2 GND - Ground H7 GND - Ground H8 GND - Ground H9 GND - Ground J1 GND - Ground J2 GND - Ground J7 GND - Ground J8 GND - Ground J9 GND - Ground K2 GND - Ground L1 GND - Ground L2 GND - Ground M3
LE910Cx HW User Guide Doc#: 1VV0301298 PAD Signal I/O Function N6 GND - Ground P3 GND - Ground P4 GND - Ground P5 GND - Ground P6 GND - Ground P8 GND - Ground P9 GND - Ground P10 GND - Ground P13 GND - Ground R2 GND - Ground R3 GND - Ground R5 GND - Ground R6 GND - Ground R8 GND - Ground R10 GND - Ground Type Comment Reserved A8 Reserved - Reserved A9 Reserved - Reserved A10 Reserved - Reserved B2 Reserved - Reserved B3 Rese
LE910Cx HW User Guide Doc#: 1VV0301298 PAD Signal I/O Function C14 Reserved - Reserved D3 Reserved - Reserved D8 Reserved - Reserved D9 Reserved - Reserved D10 Reserved - Reserved D11 Reserved - Reserved D12 Reserved - Reserved D13 Reserved - Reserved D14 Reserved - Reserved E3 Reserved - Reserved F3 Reserved - Reserved F14 Reserved - Reserved G3 Reserved - Reserved G14 Reserved - Reserved H3 Reserved - Reserved H15 Reserved - Reserved J3
LE910Cx HW User Guide Doc#: 1VV0301298 PAD Signal I/O Function N7 Reserved - Reserved N8 Reserved - Reserved N10 Reserved - Reserved N11 Reserved - Reserved N12 Reserved - Reserved P7 Reserved - Reserved P11 Reserved - Reserved P12 Reserved - Reserved - Reserved for future use. Not connected internally Type Comment Reserved for future use R4 RFU Can be tied to GND WARNING: GPIO_09 and WCI_RX are used as special HW flags during boot.
LE910Cx HW User Guide Doc#: 1VV0301298 NOTE: The following pins are unique for the LE910Cx and may not be supported on other (former or future) xE910 family modules. Special care must be taken when designing the application board if future compatibility is required.
LE910Cx HW User Guide Doc#: 1VV0301298 PAD Signal Notes N15 C103/TXD If not used, connect to a Test Point M15 C104/RXD If not used, connect to a Test Point L14 C105/RTS If flow control is not used, connect to GND P15 C106/CTS If not used, connect to a Test Point D15 TX_AUX If not used, connect to a Test Point E15 RX_AUX If not used, connect to a Test Point K1 Antenna MAIN antenna F1 ANT_DIV DIV antenna R9 ANT_GPS GPS antenna C4, C5, C6, C7, D3, E3, G3, K4, L4, P11 Reserved C
LE910Cx HW User Guide Doc#: 1VV0301298 LGA Pads Layout Figure 2: LGA Pads Layout Backward Compatibility to xE910 Family The LE910Cx is a new series in the xE910 form factor The LE910Cx is fully backward compatible to the previous xE910 in terms of: Mechanical dimensions Package and pin-map To support the extra features and additional interfaces, the LE910Cx introduces more pins compared to the xE910.
LE910Cx HW User Guide Doc#: 1VV0301298 The additional pins of the LE910Cx are shown in Figure 3 (marked as Green) Figure 3: LE910Cx vs. LE910 Pin-out Comparison (top view) Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 4. Electrical Specifications Absolute Maximum Ratings – Not Operational WARNING: A deviation from the value ranges listed below may harm the LE910Cx module. Table 8: Absolute Maximum Ratings – Not Operational Symbol Parameter Min Max Unit VBATT Battery supply voltage on pin VBATT -0.5 +6.0 [V] VBATT TRANSIENT Transient voltage on pin VBATT (< 10 ms) -0.5 +7.0 [V] VBATT_PA Battery supply voltage on pin VBATT_PA -0.3 +6.
LE910Cx HW User Guide Doc#: 1VV0301298 Logic Level Specifications Unless otherwise specified, all the interface circuits of the LE910Cx are 1.8V CMOS logic. Only few specific interfaces (such as MAC, USIM and SD Card) are capable of dual voltage I/O. The following tables show the logic level specifications used in the LE910Cx interface circuits. The data specified in the tables below is valid throughout all drive strengths and the entire temperature ranges.
LE910Cx HW User Guide Doc#: 1VV0301298 Pad Parameter Min Max Unit RPD Pull-down resistance 30 390 [kΩ] Ci Input capacitance -- 5 [pF] Comment NOTE: Pull-Up and Pull-Down resistance of GPIO3, GPIO7 and GPIO8 is different than above mentioned GPIO3 pull resistance is specified as 10KΩ to 50KΩ 4.3.3. 1.8V SD Card Pads Table 12: Operating Range – SD Card Pads Working at 1.8V Pad Parameter Min Max Unit Comment VIH Input high level 1.27V 2V [V] VIL Input low level -0.3V 0.
LE910Cx HW User Guide Doc#: 1VV0301298 4.3.4. 1.8V SIM Card Pads Table 13: Operating Range – SIM Pads Working at 1.8V Pad Parameter Min Max Unit Comment VIH Input high level 1.35V 2V [V] VIL Input low level -0.3V 0.43V [V] VOH Output high level 1.35V 1.875V [V] VOL Output low level 0V 0.
LE910Cx HW User Guide Doc#: 1VV0301298 Pad Parameter IIH High-level input leakage current RPU Pull-up resistance RPD Pull-down resistance Ci Input capacitance 4.3.7. Min Max Unit 10 [uA] 10 100 [kΩ] 10 100 [kΩ] 5 [pF] Comments No pull-down SIM Card Pads @2.95V Table 16: Operating Range – For SIM Pads Operating at 2.95V Pad Parameter Min Max Unit VIH Input high level 2.1V 3.1V [V] VIL Input low level -0.3V 0.55V [V] VOH Output high level 2.25V 3.
LE910Cx HW User Guide Doc#: 1VV0301298 5. Hardware Commands Turning on the LE910Cx Module To turn on the LE910Cx module, the ON_OFF_N pad must be asserted low for at least 1 second and then released. The maximum current that can be drained from the ON/OFF # pad is 0.1 mA. This pin is internally pulled up; customers should expect to see ~ 800 mV on the output. Figure 4 illustrates a simple circuit to power on the module using an inverted buffer output.
LE910Cx HW User Guide Doc#: 1VV0301298 Figure 5: LE910Cx Initialization and Activation VBATT 1 Sec < T_Hold < 2 Sec ON_OFF T_RDY < 20 Sec SW_RDY OK to Send AT commands 18 Sec < T_PWRMON < 20 Sec V_AUX PWRMON OFF State Initialization State All interfaces and pins configured Active State NOTE: SW_RDY signal is available on GPIO_08 (by default GPIO_08 functions as SW_RDY) NOTE: To check whether the LE910Cx has completely powered on, monitor the SW_RDY hardware line.
LE910Cx HW User Guide Doc#: 1VV0301298 NOTE: For systems not requiring controlled power ON/OFF, automatic power on can be supported by shorting the ON_OFF signal directly GND In this case, the module will start power on sequence immediately after VBATT supply is applied NOTE: Active low signals are labeled with a name that ends with "#" or with “_N” NOTE: To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is pow
LE910Cx HW User Guide Doc#: 1VV0301298 Turning off the LE910Cx Module Turning off the device can be done in the following different ways: Shutdown by software using AT#SHDN software command Hardware shutdown using ON_OFF_N pad Hardware Unconditional Shutdown using the SHDN_N pad When the device is shut down by a software command or a hardware shutdown, it issues a detach request to the network, informing the network that the device will not be reachable any more.
LE910Cx HW User Guide Doc#: 1VV0301298 5.3.1. Shutdown by Software Command The LE910Cx module can be shut down by a software command. When a shutdown command is sent, LE910Cx goes into the Finalization state and at the end of the finalization process shuts down PWRMON. The duration of the Finalization state can differ according to the current situation of the module, so a value cannot be defined.
LE910Cx HW User Guide Doc#: 1VV0301298 5.3.2. Hardware Shutdown To turn off the LE910Cx module, the ON_OFF_N pad must be asserted low for at least 2.5 seconds and then released. Use the same circuitry and timing for power-on. When the hold time of ON/OFF# is above 2.5 seconds, LE910Cx goes into the Finalization state and eventually shuts down PWRMON. The duration of the Finalization state can differ according to the current situation of the module, so a value cannot be defined.
LE910Cx HW User Guide Doc#: 1VV0301298 5.3.3. Unconditional Hardware Shutdown To unconditionally shut down the LE910Cx module, the HW_SHUTDOWN_N pad must be tied low for at least 200 milliseconds and then released. Figure 8 shows a simple circuit for applying an unconditional shutdown. Figure 8: Circuit for Unconditional Hardware Shutdown Figure 9 shows the system power-down timing when using HW_SHUTDOWN_N.
LE910Cx HW User Guide Doc#: 1VV0301298 NOTE: Do not use any pull-up resistor on the HW_SHUTDOWN_N line or any totem pole digital output. Using a pull-up resistor may cause latch-up problems on the LE910Cx power regulator and improper functioning of the module. The HW_SHUTDOWN_N line must be connected only in an open-collector configuration.
LE910Cx HW User Guide Doc#: 1VV0301298 Fast Power Down The graceful power down procedure is described in chapter 5.1 and 5.2. It normally takes more than 15 seconds to de-attach network and make LE910Cx internal filesystem properly closed. In case of unwanted power supply loss, LE910Cx can be switched off without any risk of filesystem data corruption by implementing Fast Power Down feature. The Fast Power Down feature permits to reduce the current consumption and the time-topower off to minimum values.
LE910Cx HW User Guide Doc#: 1VV0301298 NOTE: Consider voltage drop under max current conditions when defining the voltage detector threshold in order to avoid unwanted shutdown. The most important thing is that a system should give sufficient energy LE910Cx turns off safely during 30ms after the Fast Shut Down is triggered. If not, unwanted memory corruption can be happened. VAUX pin can be used to check if LE910Cx is turned off. If VUAX is low, LE910Cx is turned off.
LE910Cx HW User Guide Doc#: 1VV0301298 NOTE: Make the same plot during system verification to check timings and voltages levels. WARNING: Ctank associated with low ESR requires current limiting feature in DCDC converter to avoid side effect of inrush current. 5.5.2. Fast Shut Down by Software The Fast Power Down can be triggered directly by AT command. Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 6. Power Supply The power supply circuitry and board layout are very important parts of the full product design, with critical impact on the overall product performance. Read the following requirements and guidelines carefully to ensure a good and proper design. Power Supply Requirements The LE910Cx power requirements are as follows: Table 17: Power Supply Requirements Nominal supply voltage 3.8V Supply voltage range 3.4V – 4.
LE910Cx HW User Guide Doc#: 1VV0301298 Mode Average (Typ.) Mode Description 1.8mA Paging cycle #256 frames (2.
LE910Cx HW User Guide Doc#: 1VV0301298 NOTE: The electrical design for the power supply must ensure a peak current output of at least 2.0A. NOTE: In GSM/GPRS mode, RF transmission is not continuous, but is packed into bursts at a base frequency of about 216 Hz with relative current peaks as high as about 2.0A. Therefore, the power supply must be designed to withstand these current peaks without big voltage drops.
LE910Cx HW User Guide Doc#: 1VV0301298 Make sure that the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V. A protection diode must be inserted close to the power input to protect the LE910Cx module from power polarity inversion. Figure 10 shows an example of a linear regulator with 5V input. Figure 10: Example of Linear Regulator with 5V Input 6.3.1.2.
LE910Cx HW User Guide Doc#: 1VV0301298 Figure 13 and Figure 14 show an example of switching regulator with 12V input. Figure 11: Example of Switching Regulator with 12V Input – Part 1 Figure 12: Example of Switching Regulator with 12V Input – Part 2 6.3.1.3. Battery Source Power Supply – Design Guidelines The desired nominal output for the power supply is 3.8V, and the maximum allowed voltage is 4.2V. Hence, a single 3.
LE910Cx HW User Guide Doc#: 1VV0301298 6.3.2.
LE910Cx HW User Guide Doc#: 1VV0301298 6.3.3. Power Supply PCB Layout Guidelines As seen in the electrical design guidelines, the power supply must have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct operation of the circuitry. A misplaced component can be useless or can even decrease the power supply performances.
LE910Cx HW User Guide Doc#: 1VV0301298 7. Antenna(s) Antenna connection and board layout design are the most important parts in the full product design, and they have a strong influence on the product’s overall performance. Read carefully and follow the requirements and guidelines for a good and proper design.
LE910Cx HW User Guide Doc#: 1VV0301298 Furthermore, if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC approval requirements: This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.
LE910Cx HW User Guide Doc#: 1VV0301298 GSM/WCDMA/LTE Antenna – Installation Guidelines Install the antenna in a location with access to the network radio signal. The antenna must be installed such that it provides a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. The antenna must not be installed inside metal cases.
LE910Cx HW User Guide Doc#: 1VV0301298 GNSS Antenna Requirements LE910Cx supports an active antenna. It is recommended to use antennas as follow: An external active antenna (17dB typ. Gain, GPS only) An external active antenna plus GNSS pre-filter (17dB typ. Gain) NOTE: The external GNSS pre-filter is required for the GLONASS application. The GNSS pre-filter must meet the following requirements: Source and load impedance = 50 Ohm Insertion loss (1575.42–1576.42 MHz) = 1.
LE910Cx HW User Guide Doc#: 1VV0301298 7.5.3. Front End Design Considerations Since there is no antenna connector on the LE910Cx module, the antenna must be connected to the LE910Cx through the PCB to the antenna pad. If the antenna is not directly connected at the antenna pad of the LE910Cx, a PCB line is required. This line of transmission must meet the following requirements: Table 22: Antenna Line on PCB Requirements Characteristic impedance 50 Ohm Max attenuation 0.
LE910Cx HW User Guide Doc#: 1VV0301298 GNSS Antenna – Installation Guidelines The LE910Cx, due to its sensitivity characteristics, is capable of performing a fix inside buildings. (In any case, the sensitivity could be affected by the building characteristics i.e. shielding.) The antenna must not be co-located or operating in conjunction with any other antenna or transmitter. The antenna must not be installed inside metal cases.
LE910Cx HW User Guide Doc#: 1VV0301298 8. Hardware Interfaces Table 23 summarizes all the hardware interfaces of the LE910Cx module. Table 23: LE910Cx Hardware Interfaces Interface LE910Cx SGMII For Ethernet support HSIC x1 (Optional) SD/MMC x1 dual voltage interface for supporting SD/MMC card SDIO For WIFI support (1.8V only) USB USB2.
LE910Cx HW User Guide Doc#: 1VV0301298 USB Port The LE910Cx module includes a Universal Serial Bus (USB) transceiver, which operates at USB high-speed (480Mbits/sec). It can also operate with USB full-speed hosts (12Mbits/sec). It is compliant with the USB 2.0 specification and can be used for control and data transfers as well as for diagnostic monitoring and firmware update. The USB port is typically the main interface between the LE910Cx module and OEM hardware.
LE910Cx HW User Guide Doc#: 1VV0301298 NOTE: Even if USB communication is not used, it is still highly recommended to place an optional USB connector on the application board. At least test points of the USB signals are required since the USB physical communication is needed in the case of SW update. NOTE: USB OTG support is optional and is not supported by default.
LE910Cx HW User Guide Doc#: 1VV0301298 Table 25: Ethernet Control Interface Signals PAD Signal I/O Function Type Comment MAC to PHY Clock 2.85V Logic Level Specifications are shown in Section 4.3.7, SIM Card Pads @2.95V, Table 16 C2 MAC_MDC O C1 MAC_MDIO I/O MAC to PHY Data D1 ETH_RST_N O Reset to Ethernet PHY 2.85V G4 ETH_INT_N Interrupt from Ethernet PHY 1.8V I 2.
LE910Cx HW User Guide Doc#: 1VV0301298 Serial Ports The serial port is typically a secondary interface between the LE910Cx module and OEM hardware. The following serial ports are available on the module: Modem Serial Port 1 (Main) Modem Serial Port 2 (Auxiliary) Several serial port configurations can be designed for the OEM hardware. The most common are: RS232 PC com port Microcontroller UART @ 1.8V (Universal Asynchronous Receive Transmit) Microcontroller UART @ 3.
LE910Cx HW User Guide Doc#: 1VV0301298 RS232 Pin# Signal Pad No. Name Usage 7 RTS RTS_UART L14 Request to Send Input to LE910Cx controlling the Hardware flow control 8 CTS CTS_UART P15 Clear to Send Output from LE910Cx controlling the Hardware flow control 9 RI RI_UART R14 Ring Indicator Output from LE910Cx indicating the Incoming call condition NOTE: DCD, DTR, DSR, RI signals that are not used for UART functions can be configured as GPIO using AT commands.
LE910Cx HW User Guide Doc#: 1VV0301298 8.4.2. Modem Serial Port 2 On the LE910Cx, Serial Port 2 is a +1.8V UART with Rx and Tx signals only. The UART functionality is shared with SPI, thus simultaneous use of SPI and UART is not supported. Table 27 lists the signals of the LE910Cx Serial Port 2. Table 27: Modem Serial Port 2 Signals PAD Signal I/O Function Type Comment D15 TXD_AUX O Auxiliary UART (Tx Data to DTE) 1.8V Shared with SPI_MOSI E15 RXD_AUX I Auxiliary UART (Rx Data to DTE) 1.
LE910Cx HW User Guide Doc#: 1VV0301298 By convention, the driver is the level translator from the 0-1.8V UART to the RS232 level. The receiver is the translator from the RS232 level to 0-1.8V UART. To translate the whole set of control lines of the UART, the following is required: 2 drivers 2 receivers WARNING: The digital input lines, operating at 1.8V CMOS levels, have absolute maximum input voltage of 2.0V. The level translator IC outputs on the module side (i.e.
LE910Cx HW User Guide Doc#: 1VV0301298 Peripheral Ports In addition to the LE910Cx serial ports, the LE910Cx supports the following peripheral ports: SPI – Serial Peripheral Interface I2C - Inter-integrated circuit SD/MMC Card Interface SDIO Interface 8.5.1. SPI – Serial Peripheral Interface The LE910Cx SPI supports the following: Master Mode only 1.8V CMOS level Up to 50 MHz clock rate NOTE: SPI is supported only on the Linux side.
LE910Cx HW User Guide Doc#: 1VV0301298 8.5.2. I2C - Inter-integrated Circuit The LE910Cx supports an I2C interface on the following pins: B11 - I2C_SCL B10 - I2C_SDA The I2C can also be used externally by the end customer application. In addition, SW emulated I2C functionality can be used on GPIO pins 1-10. Any GPIO (among GPIO 1-10) can be configured as SCL or SDA. LE910Cx supports I2C Master Mode only. NOTE: SW emulated I2C on GPIO lines is supported only from the modem side.
LE910Cx HW User Guide Doc#: 1VV0301298 Table 29 lists the LE910Cx SD card signals. Table 29: SD Card Signals PAD Signal I/O Function Type Comments J12 SD/MMC_CMD O SD command 1.8/2.95V F12 SD/MMC_CLK O SD card clock 1.8/2.95V E12 SD/MMC_DATA0 I/O SD Serial Data 0 1.8/2.95V G12 SD/MMC_DATA1 I/O SD Serial Data 1 1.8/2.95V K12 SD/MMC_DATA2 I/O SD Serial Data 2 1.8/2.95V H12 SD/MMC_DATA3 I/O SD Serial Data 3 1.8/2.95V G13 SD/MMC_CD I SD card detect input 1.
LE910Cx HW User Guide Doc#: 1VV0301298 NOTE: SD/MMC is supported only on the Linux side. The power supply to the SD/MMC card is to be provided by the Host application board. The LE910Cx does not provide a dedicated power supply for the SD/MMC card. VMMC Supply is limited to 50mA thus can only supply the MMC card external pull-up resistors. Pull-up resistors must be placed on the host application board. The card detection input has an internal pull-up resistor.
LE910Cx HW User Guide Doc#: 1VV0301298 PAD Signal I/O Function Type M13 WIFI_SD_DATA1 I/O WiFi SD Serial Data 1 1.8V K13 WIFI_SD_DATA2 I/O WiFi SD Serial Data 2 1.8V H13 WIFI_SD_DATA3 I/O WiFi SD Serial Data 3 1.8V L12 WIFI_SDRST O WiFi Reset / Power enable control 1.8V M8 WCI_TX O Wireless coexistence interface TXD 1.8V M9 WCI_RX I Wireless coexistence interface RXD 1.8V Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 Audio Interface The LE910Cx module supports a digital audio interface. 8.6.1. Digital Audio The LE910Cx module can be connected to an external codec through the digital interface. The product provides a single Digital Audio Interface (DVI) on the following pins: Table 31: Digital Audio Interface (DVI) Signals PAD Signal I/O Function Type Comments B9 DVI_WA0 O Digital Audio Interface (WA0) B-PD 1.
LE910Cx HW User Guide Doc#: 1VV0301298 8.6.1.1. Short Frame Timing Diagrams Figure 17: Primary PCM Timing Table 32: PCM_CODEC Timing Parameters Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 8.6.1.2. Long Frame Timing Diagrams Figure 18: Auxiliary PCM Timing Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 Table 33: AUX_PCM_CODEC Timing Parameters Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 General Purpose I/O The general-purpose I/O pads can be configured to act in three different ways: Input Output Alternative function (internally controlled) Input pads can only be read, reporting digital values (high / low) present on the pad at the reading time. Output pads can only be written or queried and set values on the pad output. Alternative function pads can be internally controlled by LE910Cx firmware and act according to the implementation.
LE910Cx HW User Guide Doc#: 1VV0301298 WARNING: GPIO’s marked with (*) should not be pulled high externally (by the carrier board) during module power on procedure. Pulling those pads high during module power up might lead to unwanted/non-operational boot mode. The additional GPIOs below can be used in case their initial functionality is not used: Table 35: Additional GPIOs Initial Function L12 GPIO_13 I/O WIFI_SDRST Configurable CMOS GPIO 1.
LE910Cx HW User Guide Doc#: 1VV0301298 I/O Initial Function Alternate Function Type Drive Strength PAD Signal E15 GPIO_36 I/O SPI_MISO Configurable CMOS GPIO 1.8V 2-16 mA D15 GPIO_37 I/O SPI_MOSI Configurable CMOS GPIO 1.8V 2-16 mA H14 GPIO_11 I/O SPI_CS Configurable CMOS GPIO 1.8V 2-16 mA Note WARNING: GPIO’s marked with (*) should not be pulled high externally (by the carrier board) during module power on procedure.
LE910Cx HW User Guide Doc#: 1VV0301298 8.7.3. Using a GPIO Pad as Output GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pads have a push-pull output, and therefore the pullup resistor can be omitted. Figure 19: GPIO Output Pad Equivalent Circuit Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 9. Miscellaneous Functions Indication of Network Service Availability The STAT_LED pin status shows information on the network service availability and call status. In the LE910Cx module, the STAT_LED usually needs an external transistor to drive an external LED. The STAT_LED does not have a dedicated pin.
LE910Cx HW User Guide Doc#: 1VV0301298 Indication of Software Ready The SW_RDY signal provides indication about the ability of the module to receive commands. As long as the SW_RDY is asserted low, it indicates that the LE910Cx has not yet finished booting. Once the SW_RDY is asserted high, it indicates that the LE910Cx is ready to receive commands. The SW_RDY does not have a dedicated pin. The SW_RDY functionality is available on GPIO_08 pin (by default GPIO_08 functions as SW_RDY).
LE910Cx HW User Guide Doc#: 1VV0301298 Table 38: ADC Parameters Min Max Units Input voltage range 0.1 1.7 Volt AD conversion - 8 bits Resolution - < 6.6 mV 9.5.2. Using the ADC Converter An AT command is available to use the ADC function. The command is AT#ADC=1,2. The read value is expressed in mV. Refer to Ref 1: LE920x4/LE910Cx AT Command User Guide for the full description of this function.
LE910Cx HW User Guide Doc#: 1VV0301298 GNSS Characteristics Table 39 specifies the GNSS characteristics and expected performance. The values are related to typical environment and conditions. Table 39: GNSS Characteristics Typical Measurement Parameters Notes Standalone or MS Based Tracking Sensitivity -162.3 dBm Acquisition -157.5 dBm Cold Start Sensitivity -157.5 dBm Hot 1.1s GPS+GLONASS Simulator test Warm 22.1s GPS+GLONASS Simulator test Cold 29.
LE910Cx HW User Guide Doc#: 1VV0301298 10. Mounting the Module on your Board General The LE910Cx module is designed to be compliant with a standard lead-free soldering process. Finishing & Dimensions The below figure shows the mechanical dimensions of the LE910Cx module. Figure 21: LE910Cx Mechanical Dimensions (Bottom View) Pin B1 4 x Route Inhibit Lead-free Alloy: Surface finishing Ni/Au for all solder pads Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 Figure 22: LE910Cx Mechanical Dimensions (Top view) Figure 233: LE910Cx-SV/LA Mechanical Dimensions (Top view) Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 Figure 244: LE910Cx Mechanical Dimensions (Side view) Figure 255: LE910C1-SV Mechanical Dimensions (Side view) Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 Recommended Footprint for the Application Figure 26 shows the recommended footprint for the application board (dimensions are in mm). To facilitate replacing the LE910Cx module if necessary, it is suggested to design the application board with a 1.5 mm placement inhibit area around the module. It is also suggested, as a common rule for an SMT component, to avoid having a mechanical part of the application board in direct contact with the module.
LE910Cx HW User Guide Doc#: 1VV0301298 Stencil Stencil’s apertures layout can be the same as the recommended footprint (1:1). The suggested thickness of stencil foil is greater than 120 µm. PCB Pad Design The solder pads on the PCB are recommended to be of the Non-Solder Mask Defined (NSMD) type. Figure 27: PCB Pad Design Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 Recommendations for PCB Pad Dimensions (mm) Figure 28: PCB Pad Dimensions It is not recommended to place around the pads a via or micro-via that is not covered by solder resist in an area of 0.15 mm unless it carries the same signal as the pad itself. Micro via inside the pads are allowed. Holes in pad are allowed only for blind holes and not for through holes.
LE910Cx HW User Guide Doc#: 1VV0301298 Solder Paste We recommend using only “no clean” solder paste to avoid the cleaning of the modules after assembly. 10.7.1. Solder Reflow Figure 29 shows the recommended solder reflow profile. Figure 29: Solder Reflow Profile WARNING: The above solder reflow profile represents the typical SAC reflow limits and does not guarantee adequate adherence of the module to the customer application throughout the temperature range.
LE910Cx HW User Guide Doc#: 1VV0301298 Table 41: Solder Profile Characteristics Profile Feature Average ramp-up rate (TL to TP) Pb-Free Assembly 3°C/second max Preheat – Temperature min (Tsmin) 150°C – Temperature max (Tsmax) 200°C – Time (min to max) (ts) 60-180 seconds Tsmax to TL – Ramp-up rate 3°C/second max Time maintained above: – Temperature (TL) 217°C – Time (tL) 60-150 seconds Peak temperature (Tp) 245 +0/-5°C Time within 5°C of actual peak 10-30 seconds Temperature (tp) Ramp-down
LE910Cx HW User Guide Doc#: 1VV0301298 10.7.2. Cleaning In general, cleaning the module mounted on the carrier board is not recommended. Residues between module and host board cannot be easily removed with any cleaning method. Cleaning with water or any organic solvent can lead to capillary effects where the cleaning solvent is absorbed into the gap between the module and the host board or even leak inside the module (due to the gap between the module shield and PCB) .
LE910Cx HW User Guide Doc#: 1VV0301298 11.
LE910Cx HW User Guide Doc#: 1VV0301298 Bypass Capacitor on Power Supplies When a sudden voltage step to or a cut from the power supplies is asserted, the steep transition causes some reactions such as overshoot and undershoot. This abrupt voltage transition can affect the device causing it to not operate or to malfunction. Bypass capacitors are needed to alleviate this behaviour. The behaviour can appear differently depending on the various applications.
LE910Cx HW User Guide Doc#: 1VV0301298 SIM Interface This section presents the recommended schematics for the design of SIM interfaces on the application boards. The LE910Cx supports two external SIM interfaces. 11.3.1. SIM Schematic Example Figure 30 illustrates in particular how to design the application side and what values to assign the components.
LE910Cx HW User Guide Doc#: 1VV0301298 EMC Recommendations All LE910Cx signals are provided with some EMC protection. Nevertheless, the accepted level differs according to the specific pin. Table 43 lists the characteristics. Table 43: EMC Recommendations Pad Signal I/O Function Contact Air All Pins All pins All functions ± 4kV ± 8kV Antenna Analog pads I/O Antenna pad ± 4kV ± 4kV Antenna F1, K1, R9 Appropriate series resistors must be considered to protect the input lines from overvoltage.
LE910Cx HW User Guide Doc#: 1VV0301298 11.5.1. Fast Boot mode Fast boot mode is normally used by Telit SW to enter SW download mode Fastboot is triggered by GPIO_09 (PAD L15). Asserting this signal high (1.8V) during boot will force the system into Fastboot 11.5.2. Recovery Boot Mode Emergency boot download mode is used in case of corrupted boot image was flashed into the device or in case all other recovery modes failed to work Emergency download mode is triggered by WCI_RX signal (PAD M9).
LE910Cx HW User Guide Doc#: 1VV0301298 12. Packing System Packing System – Tray The LE910Cx modules are packaged on trays of 36 pieces each as shown in Figure 31. These trays can be used in SMT processes for pick & place handling. Figure 31: Packing Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 Figure 32: Tray Drawing Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 Tape & Reel The LE910Cx can be packaged on reels of 200 pieces each. See figure for module positioning into the carrier. Figure 33: Module Positioning into the Carrier Figure 34: Carrier Tape Detail Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 Figure 35: Reel Detail Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 Figure 36: Reel Box Detail Moisture Sensitivity The LE910Cx module is a Moisture Sensitive Device Level 3, in accordance with standard IPC/JEDEC J-STD-020. Observe all of the requirements for using this kind of components. Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 13. Safety Recommendations READ CAREFULLY Be sure that the use of this product is allowed in your country and in the environment required. The use of this product may be dangerous and must be avoided in the following areas: Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. Where there is risk of explosion, such as gasoline stations, oil refineries, etc.
LE910Cx HW User Guide Doc#: 1VV0301298 14. Conformity Assessment Issues FCC/ISED Regulatory Notices Information for the OEMs and Integrators The following statement must be included with all versions of this document supplied to an OEM or integrator but should not be distributed to the end user. 1) This device is intended for OEM integrators only.
LE910Cx HW User Guide Doc#: 1VV0301298 Trace antenna designs See 7.2 GSM/WCDMA/TD-SCDMA/LTE Antenna - PCB Line Guidelines Summary of the specific operational use conditions See apart 7.1 GSM/WCDMA/TD-SCDMA/LTE Antenna - Antenna requirements Modification Statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment.
LE910Cx HW User Guide Doc#: 1VV0301298 Le présent appareil est conforme à l'exposition aux radiations FCC / ISED définies pour un environnement non contrôlé et répond aux directives d'exposition de la fréquence de la FCC radiofréquence (RF) et RSS‐102 de la fréquence radio (RF) ISED règles d'exposition. Gain de l'antenne doit être ci-dessous: Frequency Band Freq [MHz] LE910C1 -NA Gain [dBi] LE910C1 -NS Gain [dBi] LE910C1/C4 -NF Gain [dBi] LE910C1 -SV Gain [dBi] LE910C1 -LA Gain [dBi] 850 MHz 850 3.
LE910Cx HW User Guide Doc#: 1VV0301298 LE910C1 NA Contains FCC ID: RI7LE910C1NA Contains IC: 5131A-LE910C1NA LE910C1 NS Contains FCC ID: RI7LE910C1NS Contains IC: 5131A-LE910C1NS LE910C1/C4 NF Contains FCC ID: RI7LE910CXNF Contains IC: 5131A-LE910CXNF LE910C1 SV Contains FCC ID: RI7LE910C1SV Contains IC: 5131A-LE910C1SV LE910C1 SA Contains FCC ID: RI7LE910C1SA Contains IC: 5131A-LE910C1SA LE910C1 ST Contains FCC ID: RI7LE910C1ST Contains IC: 5131A-LE910C1ST LE910C1 LA Contains FCC ID: RI7LE910C1LA Contains
LE910Cx HW User Guide Doc#: 1VV0301298 LE910C1/C4 NF Contains FCC ID: RI7LE910CXNF Contains IC: 5131A-LE910CXNF LE910C1 SV Contains FCC ID: RI7LE910C1SV Contains IC: 5131A-LE910C1SV LE910C1 SA Contains FCC ID: RI7LE910C1SA Contains IC: 5131A-LE910C1SA LE910C1 ST Contains FCC ID: RI7LE910C1ST Contains IC: 5131A-LE910C1ST LE910C1 LA Contains FCC ID: RI7LE910C1LA Contains IC: 5131A-LE910C1LA CAN ICES-3 (B) / NMB-3 (B) This Class B digital apparatus complies with Canadian ICES-003.
LE910Cx HW User Guide Doc#: 1VV0301298 JTBL Regulatory Notices Antenna According to Japan regulatory rule, module certification is valid only with the specific antennas registered to and approved by JRL certified body in relation to module certification. Customers who are going to use modules under Japan Radio Law, are responsible to contact Telit technical support or sales to get the list of these antennas.
LE910Cx HW User Guide Doc#: 1VV0301298 15.
LE910Cx HW User Guide Doc#: 1VV0301298 SOC System-on-Chip SPI Serial peripheral interface UART Universal asynchronous receiver transmitter UMTS Universal mobile telecommunications system USB Universal serial bus WCDMA Wideband code division multiple access WCI Wireless Coexistence Interface ADC Analog-to-digital converter AE Application-enabled DAC Digital-to-analog converter DTE Data Terminal Equipment FDD Frequency division duplex GLONASS Global orbiting navigation satellite syst
LE910Cx HW User Guide Doc#: 1VV0301298 I2C Inter-integrated circuit LTE Long term evolution SD Secure digital SGMII Serial Gigabit media-independent interface SIM Subscriber identity module SOC System-on-Chip SPI Serial peripheral interface UART Universal asynchronous receiver transmitter UMTS Universal mobile telecommunications system USB Universal serial bus WCI Wireless Coexistence Interface WCDMA Wideband code division multiple access Rev. 13.
LE910Cx HW User Guide Doc#: 1VV0301298 16. Document History Table 44: Document History Revision Date Changes 14 2019-06-07 14.1 FCC/ISED Regulatory Notices updated for LE910C1-LA 13 2019-05-14 Table 1 and 4 LE910C1-xx bis Variants removed Section 3.2 and 7– Note for C1 bis variants removed 12 2019-04-23 Table 1, 4 – Added variants Table 19,21 – Added comment 11 2019-03-22 Section 10.7.1 – Warning comment added 10 2019-03-13 Section 2.8.1 – Note added for C1-SV variant Section 3.
LE910Cx HW User Guide Doc#: 1VV0301298 Revision 4 Date 2018-08-20 Changes Table 1 & 4 - Added LE910C4-EU variant Section 2.3 – Updated SIM interface max speed Declared HSIC interface as optional throughout the document Section 2.6.2 – Updated RF frequency table Section 6.2 – Added clarification related to DRX and CFUN=5 Section 8.1 - Corrected Typo related to USB_VBUS pad number Section 8.4.1- Clarified note about DTR pin 3 2018-07-18 Section 2.8.
LE910Cx HW User Guide Doc#: 1VV0301298 Revision 1.09 Date 2017-12-07 Changes Section 14.1 – Updated LE910C1 NA 850MHz Max antenna gain. Section 6.2.2 – Corrected Class12 to Class10. 1.08 2017-11-14 Section 2.6.2 - Changed B41 to B41M Section 2.7 – Renamed from Sensitivity to RF parameters and added TX output power section (2.7.2) Section 2.8 – Added note regarding label thickness Section 3.1 - Removed duplication of description related to USB_VBUS. Section 5.2 – Added clarification regarding ON_OFF.
LE910Cx HW User Guide Doc#: 1VV0301298 Revision 1.0 Date 2016-12-22 Changes Section 1.5 - Updated “Related Documents” table Section 5.3.4 – Added Figure for SHDN_N power down timing Section 8.5.3 – Added clarification about VMMC Section 9.7 - Added GNSS characteristics 0.6 2016-12-07 Remove all China variant related information 0.5 2016-12-02 Added section 9.2 to better describe SW_RDY signal Minor modifications per typos and improved description Renaming of SHDN_N pin 0.
